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参数资料
| 型号： | MA4GP907-T |
| 元件分类： | PIN二极管 |
| 英文描述： | GALLIUM ARSENIDE, PIN DIODE |
| 封装： | FLIP CHIP-2 |
| 文件页数： | 4/4页 |
| 文件大小： | 310K |
| 代理商： | MA4GP907-T |
GaAs Flip-Chip PIN Diodes
MA4GP907
V 5.00
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
4
Parameter
Maximum Ratings
Operating Temperature
-65 °C to +125 °C
Storage Temperature
-65 °C to +150 °C
Dissipated RF & DC Power
50 mW
RF C.W. Incident Power
+ 23 dBm C.W.
Mounting Temperature
+300 °C for 10 seconds
Absolute Maximum Ratings
5
5. Exceeding any of these values may result in permanent
damage
Device Installation Procedures
The following guidelines should be observed to avoid damag-
ing GaAs Flip-Chips.
Cleanliness
These devices should be handled in a clean environment.
Do Not attempt to clean die After installation.
Static Sensitivity
Gallium arsenide PIN diodes are ESD sensitive and can be
damaged by static electricity. Proper ESD techniques should
be used when handling these devices. These devices are rated
Class 0, (0-199 V) per HBM MIL-STD-883, method 3015.7
[C = 100pF ±10%, R = 1.5kW ±1%]. Even though tested die
pass 50V ESD, they must be handled in a static-free environment.
General Handling
These devices have a polymer layer which provides scratch
protection for the junction area and the anode air bridge. Die
can be handled with plastic tweezers or picked and placed
with a #27 tip vacuum pencil.
Assembly Requirements Using
Electrically Conductive Ag Epoxy
and Solder
These chips are designed to be inserted onto hard or soft sub-
strates with the junction side down. They should be mounted
onto silkscreened circuits using Electrically Conductive Ag
Epoxy, approximately 1-2 mils in thickness and cured at ap-
proximately 90
°C to 150 °C per manufacturer’s schedule.
For extended cure times > 30 minutes, temperatures must be
below 200
°C.
Sn Rich Solders are not recommended due to the Tungsten
Metallization scheme beneath the gold contacts. Indalloy or
80 Au/20 Sn Solders are acceptable. Maximum soldering
temperature must be < 300
°C for < 10 sec.
Circuit Mounting Dimensions
(Inches)
0.012
(2) PL
0.008
(2) PL
0.013
Ordering Information
Part Number
Package
MA4GP907
Die in Carrier
MA4GP907-T
Tape and Reel
MA4GP907-W
Wafer on Frame
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