参数资料
型号: MAX11637EEE+T
厂商: Maxim Integrated Products
文件页数: 12/24页
文件大小: 0K
描述: IC ADC 12BIT 8CH 16QSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
位数: 12
采样率(每秒): 300k
数据接口: MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 1
功率耗散(最大): 667mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SSOP(0.154",3.90mm 宽)
供应商设备封装: 16-QSOP
包装: 带卷 (TR)
输入数目和类型: 8 个单端,单极;4 个差分,单极;4 个差分,双极
MAX11634–MAX11637
12-Bit, 300ksps ADCs with Differential
Track/Hold, and Internal Reference
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 3.6V (MAX11635/MAX11637), VDD = 4.75V to 5.25V (MAX11634/MAX11636), fSAMPLE = 300kHz, fSCLK = 4.8MHz
(external clock, 50% duty cycle), VREF = 2.5V (MAX11635/MAX11637), VREF = 4.096V (MAX11634/MAX11636) TA = TMIN to TMAX,
unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (VDD + 0.3V)
AIN0–AIN5, REF-/AIN6, CNVST/AIN7,
REF+ to GND.........................................-0.3V to (VDD + 0.3V)
Maximum Current into any Pin ............................................50mA
Continuous Power Dissipation (TA = +70°C)
QSOP (single-layer board)
(derate 8.3mW/°C above +70°C) .................................667mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (Note 3)
Resolution
RES
12
Bits
Integral Nonlinearity
INL
±1.0
LSB
Differential Nonlinearity
DNL
No missing codes over temperature
±1.0
LSB
Offset Error
±0.5
±4.0
LSB
Gain Error
(Note 4)
±0.5
±4.0
LSB
Offset Error Temperature
Coefficient
±2
ppm/°C
FSR
Gain Temperature Coefficient
±0.8
ppm/°C
Channel-to-Channel Offset
Matching
±0.1
LSB
DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 300ksps, fSCLK = 4.8MHz)
MAX11635/MAX11637
71
Signal-to-Noise Plus Distortion
SINAD
MAX11634/MAX11636
73
dB
MAX11635/MAX11637
-80
Total Harmonic Distortion
THD
Up to the 5th
harmonic
MAX11634/MAX11636
-88
dBc
MAX11635/MAX11637
81
Spurious-Free Dynamic Range
SFDR
MAX11634/MAX11636
89
dBc
Intermodulation Distortion
IMD
fIN1 = 29.9kHz, fIN2 = 30.2kHz
76
dBc
Full-Power Bandwidth
-3dB point
1
MHz
Full-Linear Bandwidth
S/(N + D) > 68dB
100
kHz
PACKAGE THERMAL CHARACTERISTICS (Note 1)
QSOP
Junction-to-Ambient Thermal Resistance (
θJA)...............105°C/W
Junction-to-Case Thermal Resistance (
θJC)......................37°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
相关PDF资料
PDF描述
MAX11643EEG+T IC ADC 8BIT 8CH 24QSOP
MAX11645EUA+T IC ADC 12BIT I2C/SRL 1CH 8UMAX
MAX11647EUA+T IC ADC 10BIT I2C 94.4KSPS 8UMAX
MAX1166BEUP+ IC ADC 16BIT 165KSPS 20-TSSOP
MAX1168BCEG+ IC ADC 16BIT 200KSPS 24-QSOP
相关代理商/技术参数
参数描述
MAX11638EEE+ 功能描述:模数转换器 - ADC 8Ch 8-Bit 300ksps w/FIFO & Int Ref RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
MAX11638EEE+T 功能描述:模数转换器 - ADC 8Ch 8-Bit 300ksps w/FIFO & Int Ref RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
MAX11639EEE+ 功能描述:模数转换器 - ADC 8Ch 8-Bit 300ksps w/FIFO & Int Ref RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
MAX11639EEE+T 功能描述:模数转换器 - ADC 8Ch 8-Bit 300ksps w/FIFO & Int Ref RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
MAX11642EEG+ 功能描述:模数转换器 - ADC 16Ch 8-Bit 300ksps w/FIFO & Int Ref RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32