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参数资料
| 型号： | MAX13047EEVB+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 4/15页 |
| 文件大小： | 0K |
| 描述： | IC XLATOR BIDIRECT LEVEL 10UTQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 100 |
| 逻辑功能： | 变换器，双向 |
| 位数： | 2 |
| 输入类型： | CMOS |
| 输出类型： | CMOS |
| 数据速率： | 16Mbps |
| 通道数： | 2 |
| 输出/通道数目： | 1 |
| 差分 - 输入:输出： | 无/无 |
| 传输延迟（最大）： | 15ns |
| 电源电压： | 1.65 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 10-UFQFN |
| 供应商设备封装： | 10-UTQFN（1.4x1.8） |
| 包装： | 管件 |
MAX13046E/MAX13047E
typical application involves interfacing a low-voltage
microprocessor to an external memory, such as the
DS2502. The maximum data rate depends on the
1-Wire device. For the DS2502, the maximum data rate
is 16.3kbps. A 5kΩ pullup resistor is recommended
when interfacing with the DS2502.
Push-Pull vs. Open-Drain Driving
The MAX13046E/MAX13047E can be driven in a push-
pull or open-drain configurations. For open-drain con-
figuration, internal 10kΩ resistors pull up I/O VL and I/O
VCC to their respective power supplies. See the Timing
Characteristics table for maximum data rates when
using open-drain drivers.
PCB Layout
The MAX13046E/MAX13047E require good PCB layout
for proper operation and optimal rise/fall time perfor-
mance. Ensure proper high-frequency PCB layout even
when operating at low data rates.
Driving High-Capacitive Load
Capacitive loading on the I/O lines impacts the rise time
(and fall time) of the MAX13046E/MAX13047E when dri-
ving the signal lines. The actual rise time is a function of
the load capacitance, parasitic capacitance, the supply
voltage, and the drive impedance of the MAX13046E/
MAX13047E.
Operating the MAX13046E/MAX13047E at a low data rate
does NOT increase capacitive load driving capability.
Single- and Dual-Bidirectional
Low-Level Translator
12
______________________________________________________________________________________
IP 100%
90%
36.8%
tRL
TIME
tDL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
Ir
10%
0
AMPERES
Figure 2b. Human Body Current Waveform
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
100pF
RC
1M
Ω
RD
1500
Ω
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 2a. Human Body ESD Test Model
100%
90%
60ns
10%
tr = 0.7ns TO 1ns
I PEAK
I
30ns
t
Figure 3b. IEC 61000-4-2 ESD Generator Current Waveform
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
RC
50M
Ω TO 100MΩ
RD
330
Ω
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 3a. IEC 61000-4-2 ESD Test Model
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX13047EEVB+ | 功能描述:转换 - 电压电平 Single 8Mbps 3.6V RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MAX13047EEVB+T | 功能描述:转换 - 电压电平 Single 8Mbps 3.6V RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MAX13047EEVKIT+ | 功能描述:电源管理IC开发工具 MAX13047E Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX1304ECM | 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX1304ECM/V+ | 功能描述:模数转换器 - ADC 12-Bit 8Ch 1.075Msps 3V Precision ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
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