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| 型号： | MAX13047EEVB+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 8/15页 |
| 文件大小： | 0K |
| 描述： | IC XLATOR BIDIRECT LEVEL 10UTQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 100 |
| 逻辑功能： | 变换器，双向 |
| 位数： | 2 |
| 输入类型： | CMOS |
| 输出类型： | CMOS |
| 数据速率： | 16Mbps |
| 通道数： | 2 |
| 输出/通道数目： | 1 |
| 差分 - 输入:输出： | 无/无 |
| 传输延迟（最大）： | 15ns |
| 电源电压： | 1.65 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 10-UFQFN |
| 供应商设备封装： | 10-UTQFN（1.4x1.8） |
| 包装： | 管件 |
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +1.65V to +5.5V, VL = +1.1V to minimum of either +3.6V or ((VCC + 0.3V)), I/O VL and I/O VCC are unconnected, TA = -40°C to
+85°C, unless otherwise noted. Typical values are VCC = +3.3V, VL = +1.8V at TA = +25°C.) (Notes 2, 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
VCC ...........................................................................-0.3V to +6V
VL..............................................................................-0.3V to +4V
I/O VCC .......................................................-0.3V to (VCC + 0.3V)
I/O VL ............................................................-0.3V to (VL + 0.3V)
SHDN........................................................................-0.3V to +6V
Short-Circuit Duration I/O VL, I/O VCC to GND...........Continuous
Power Dissipation (TA = +70°C)
6-Pin DFN (derate 2.1mW/°C above +70°C) .............168mW
10-Pin UTQFN (derate 6.9mW/°C above +70°C).........559mW
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
6-Pin DFN .................................................................477°C/W
10-Pin UTQFN ...........................................................20.1°C/W
Junction-to-Ambient Thermal Resistance (
θJC) (Note 1)
6-Pin DFN ................................................................20.1°C/W
10-Pin UTQFN .........................................................143.1°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
VCC > 3.3V
1.1
3.6V
VL Supply Range
VL
VCC
≤ 3.3V
1.1
VCC + 0.3V
V
VCC Supply Range
VCC
1.65
5.5
V
Supply Current from VCC
IQVCC
10
A
Supply Current from VL
IQVL
15
A
VCC Shutdown-Mode Supply Current
ISD-VCC
TA = +25°C, SHDN = GND
0.03
1A
VL Shutdown-Mode Supply Current
ISD-VL
TA = +25°C, SHDN = GND
0.03
1A
I/O VL and I/O VCC Shutdown-Mode
Leakage Current
ISD-LKG
TA = +25°C, SHDN = GND
0.02
0.5
A
SHDN Input Leakage
TA = +25°C
0.02
0.1
A
ESD PROTECTION
Human Body Model
±15V
IEC 61000-4-2 Air-Gap Discharge
±15V
I/O VCC (Note 4)
IEC 61000-4-2 Contact Discharge
±8V
kV
All Other Pins
Human Body Model
±2
kV
LOGIC-LEVEL THRESHOLDS
I/O VL Input-Voltage High
VIHL
VL -
0.2
V
I/O VL Input-Voltage Low
VILL
0.15
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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