参数资料
型号: MAX15023EVKIT+
厂商: Maxim Integrated Products
文件页数: 2/28页
文件大小: 0K
描述: KIT EVALUATION FOR MAX15023 CTLR
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 2,非隔离
输出电压: 1.2V,3.3V
电流 - 输出: 10A,5A
输入电压: 9 ~ 16 V
稳压器拓扑结构: 降压
频率 - 开关: 500kHz
板类型: 完全填充
已供物品:
已用 IC / 零件: MAX15023
MAX15023
Wide 4.5V to 28V Input, Dual-Output
Synchronous Buck Controller
ABSOLUTE MAXIMUM RATINGS
IN to SGND.............................................................-0.3V to +30V
BST_ to V CC ............................................................-0.3V to +30V
LX_ to SGND .............................................................-1V to +30V
EN_ to SGND............................................................-0.3V to +6V
PGOOD_ to SGND .................................................-0.3V to +30V
BST_ to LX_ ..............................................................-0.3V to +6V
DH_ to LX_ ..........................................….-0.3V to (V BST_ + 0.3V)
DL_ to PGND_ ............................................-0.3V to (V CC + 0.3V)
SGND to PGND_ .................................................. -0.3V to +0.3V
V CC to SGND................-0.3V to the lower of +6V or (V IN + 0.3V)
V CC Short Circuit to SGND.........................................Continuous
V CC Input Current (IN = V CC , internal LDO not used) ......600mA
PGOOD_ Sink Current ........................................................20mA
Continuous Power Dissipation (T A = +70°C)(Note 1)
24-Pin TQFN-EP (derate 27.8mW/°C above +70°C)......2222.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
All Other Pins to SGND...............................-0.3V to (V CC + 0.3V)
Note 1: These power limits are due to the thermal characteristics of the package, absolute maximum junction temperature (150°C),
and the JEDEC 51-7 defined setup. Maximum power dissipation could be lower, limited by the thermal shutdown protection
included in this IC.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
24 TQFN-EP
Junction-to-Ambient Thermal Resistance ( θ JA )...............+36°C/W
Junction-to-Case Thermal Resistance ( θ JC )......................+8°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to http://www.maximintegrated.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = 12V, R T = 33k ? , C VCC = 4.7μF, C IN = 1μF, T A = -40°C to +85°C, unless otherwise noted. Typical values are at T A = +25°C.)
(Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
Input Voltage Range
Quiescent Supply Current
Standby Supply Current
V IN
I IN
I IN_SBY
V IN = V CC
V FB1 = V FB2 = 0.9V, no switching
V EN1 = V EN2 = V SGND
5.5
4.5
4.5
0.21
28
5.5
6
0.35
V
mA
mA
V CC REGULATOR
Output Voltage
V CC
6V < V IN < 28V, I LOAD = 5mA
V IN = 6V, 1mA < I LOAD < 100mA
5.00
5.2
5.50
V
V CC Regulator Dropout
I LOAD = 100mA
0.07
V
V CC Short-Circuit Output Current
V IN = 5V
150
250
mA
V CC Undervoltage Lockout
V CC_UVLO V CC falling
3.6
3.8
4
V
V CC Undervoltage Lockout
Hysteresis
ERROR AMPLIFIER (FB_, COMP _)
430
mV
FB_ Input Voltage Set-Point
V FB_
594
600
606
mV
FB_ Input Bias Current
I FB_
V FB_ = 0.6V
-250
+250
nA
2
Maxim Integrated
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