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| 型号： | MAX15039ETG+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/19页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 6A 24TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.6 V ~ 4.95 V |
| 输入电压： | 2.9 V ~ 5.5 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 500kHz ~ 2MHz |
| 电流 - 输出： | 6A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 24-TQFN-EP（4x4） |
6A, 2MHz Step-Down Regulator
with Integrated Switches
ABSOLUTE MAXIMUM RATINGS
IN, PWRGD to GND..................................................-0.3V to +6V
V DD to GND..................-0.3V to the lower of +4V or (V IN + 0.3V)
COMP, FB, MODE, REFIN, CTL1, CTL2, SS,
FREQ to GND ..........................................-0.3V to (V DD + 0.3V)
OUT, EN to GND ......................................................-0.3V to +6V
BST to LX..................................................................-0.3V to +6V
BST to GND ............................................................-0.3V to +12V
PGND to GND .......................................................-0.3V to +0.3V
LX to PGND ..................-0.3V to the lower of +6V or (V IN + 0.3V)
LX to PGND ..........-1V to the lower of +6V or (V IN + 1V) for 50ns
I LX(RMS) (Note 1) ......................................................................6A
V DD Output Short-Circuit Duration .............................Continuous
Converter Output Short-Circuit Duration ....................Continuous
Continuous Power Dissipation (T A = +70°C)
24-Pin TQFN (derate 27.8mW/°C above +70°C) ........2222mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: LX has internal clamp diodes to PGND and IN. Applications that forward bias these diodes should take care not to exceed
the IC’s package power dissipation limits.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance ( θ JA ) ............36°C/W
Junction-to-Case Resistance ( θ JC ).................................6°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = V EN = 5V, C VDD = 2.2μF, T A = T J = -40°C to +85°C, typical values are at T A = +25°C, circuit of Figure 1, unless otherwise
noted.) (Note 3)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
IN
IN Voltage Range
2.9
5.5
V
IN Supply Current
Total Shutdown Current from IN
f S = 1MHz, no load
V IN = 5V, V EN = 0V
V IN = V DD = 3.3V, V EN = 0V
V IN = 3.3V
V IN = 5V
4.9
5.2
10
45
8
8.5
20
mA
μA
3.3V LDO (V DD )
V DD Undervoltage Lockout
Threshold
V DD Output Voltage
LX starts/stops switching
V IN = 5V, I VDD = 0 to 10mA
V DD rising
V DD falling
Minimum glitch-width
rejection
2.35
3.1
2.6
2.55
10
3.3
2.8
3.5
V
μs
V
V DD Dropout
V IN = 2.9V, I VDD = 10mA
0.08
V
V DD Current Limit
V IN = 5V, V DD = 0V
25
40
mA
BST
BST Supply Current
V BST = V IN = 5V, V LX = 0 or 5V, V EN = 0V
0.025
μA
PWM COMPARATOR
PWM Comparator Propagation
Delay
PWM Peak-to-Peak Ramp
Amplitude
PWM Valley Amplitude
10mV overdrive
20
1
0.8
ns
V
V
2
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