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| 型号： | MAX15118EWI+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/23页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 18A 28WLP |
| 产品培训模块： | Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.6 V ~ 5.17 V |
| 输入电压： | 2.7 V ~ 5.5 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 1MHz |
| 电流 - 输出： | 18A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-WFBGA，WLBGA |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 28-WLP（3.5x2） |
MAX15118
High-Efficiency, 18A, Current-Mode Synchronous
Step-Down Regulator with Integrated Switches
ABSOLUTE MAXIMUM RATINGS
IN, PGOOD to GND ................................................-0.3V to +6V
EN, COMP, FB, SS/REFIN, GSNS, SKIP,
LX to GND ..............................................-0.3V to (V IN + 0.3V)
LX to GND (for 50ns)........................................-1V to (V IN + 1V)
LX to GND (for 10ns)........................................-2V to (V IN + 2V)
BST to LX.................................................................-0.3V to +6V
BST to GND ...........................................................-0.3V to +12V
BST to IN .................................................................-0.3V to +6V
LX Continuous Current (Note 1) ......................................... Q 26A
Output Short-Circuit Duration ...................................Continuous
Continuous Power Dissipation
WLP (derate 81.53mW/ N C above +70 N C)......................3.26W
Operating Temperature Range .......................... -40 N C to +85 N C
Junction Temperature (Note 2) .......................................+110 N C
Storage Temperature Range............................ -65 N C to +150 N C
Bump Reflow Temperature (Note 3) ...............................+260 N C
Note 1: LX has internal clamp diodes to GND and IN. Applications that forward bias these diodes must take care not to exceed
the IC’s package power dissipation limits.
Note 2: Limit the junction temperature to +110 N C for continuous operation at maximum output current.
Note 3: The WLP package is constructed using a unique set of package techniques that impose a limit on the thermal profile. The
device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder pro-
files recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection
reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 4)
WLP
Junction-to-Ambient Thermal Resistance ( q JA ) .......20.6°C/W
Junction-to-Case Thermal Resistance ( q JC ) ..................12.3°C/W
Note 4: Package thermal resistances were obtained using the MAX15118 evaluation board.
DC ELECTRICAL CHARACTERISTICS
(V IN = 5V, see the Typical Operating Circuits , T A = -40 N C to +85 N C. Typical values are at T A = +25 N C, unless otherwise noted.) (Note 5)
PARAMETER
IN Voltage Range
IN Supply Current
IN Shutdown Current
IN Undervoltage Lockout
Threshold
SYMBOL
V IN
I IN
I SHDN
V UVLO
CONDITIONS
V EN = V IN , V FB = 0.65V, no switching
V EN = 0V
V IN rising, LX starts switching
MIN
2.7
TYP
4.8
0.01
2.6
MAX
5.5
7
3
2.68
UNITS
V
mA
F A
V
IN Undervoltage Lockout
Threshold Hysteresis
V IN falling, LX stops switching
200
mV
ERROR AMPLIFIER
Transconductance
Voltage Gain
g M
A VEA
1.2
90
mS
dB
FB Setpoint Voltage
FB Input Bias Current
V FB
I FB
Over line, load, and temperature
0.594
-500
0.600
0.606
+500
V
nA
COMP to Current-Sense
Transconductance
COMP Clamp Low Voltage
Slope Compensation Ramp
Amplitude
g MC
V SLOPE
V FB = 0.65V, V SS/REFIN = 0.6V
150
0.97
130
A/V
V
mV
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