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参数资料
| 型号： | MAX16066ETL+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 48/62页 |
| 文件大小： | 0K |
| 描述： | IC SYSTEM MANAGER 8CH 40-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 50 |
| 应用： | 电源监控器，序列发生器 |
| 电源电压： | 2.8 V ~ 14 V |
| 电流 - 电源： | 4.5mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 40-WFQFN 裸露焊盘 |
| 供应商设备封装： | 40-TQFN-EP（6x6） |
| 包装： | 管件 |
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12-Channel/8-Channel, Flash-Configurable System
Managers with Nonvolatile Fault Registers
exit1-IR state. If TMS is low on the rising edge of TCK, the
controller enters the shift-IR state.
Shift-IR: In this state, the shift register in the instruction
register connects between TDI and TDO and shifts data
one stage for every rising edge of TCK toward the TDO
serial output while TMS is low. The parallel outputs of
the instruction register as well as all test data registers
remain at the previous states. A rising edge on TCK with
TMS high moves the controller to the exit1-IR state. A
rising edge on TCK with TMS low keeps the controller in
the shift-IR state while moving data one stage through
the instruction shift register.
Exit1-IR: A rising edge on TCK with TMS low puts the
controller in the pause-IR state. If TMS is high on the
rising edge of TCK, the controller enters the update-IR
state.
Pause-IR: Shifting of the instruction shift register halts
temporarily. With TMS high, a rising edge on TCK puts
the controller in the exit2-IR state. The controller remains
in the pause-IR state if TMS is low during a rising edge
on TCK.
Exit2-IR: A rising edge on TCK with TMS high puts the
controller in the update-IR state. The controller loops
back to shift-IR if TMS is low during a rising edge of TCK
in this state.
Update-IR: The instruction code that has been shifted
into the instruction shift register latches to the parallel
outputs of the instruction register on the falling edge of
TCK as the controller enters this state. Once latched,
this instruction becomes the current instruction. A rising
edge on TCK with TMS low puts the controller in the run-
test/idle state. With TMS high, the controller enters the
select-DR-scan state.
Instruction Register
The instruction register contains a shift register as well
as a latched 5-bit wide parallel output. When the TAP
controller enters the shift-IR state, the instruction shift
register connects between TDI and TDO. While in the
shift-IR state, a rising edge on TCK with TMS low shifts
the data one stage toward the serial output at TDO. A
rising edge on TCK in the exit1-IR state or the exit2-IR
state with TMS high moves the controller to the update-IR
state. The falling edge of that same TCK latches the data
in the instruction shift register to the instruction register
parallel output. Table 30 shows the instructions sup-
ported by the MAX16065/MAX16066 and the respective
operational binary codes.
BYPASS: When the BYPASS instruction is latched into
the instruction register, TDI connects to TDO through the
1-bit bypass test data register. This allows data to pass
from TDI to TDO without affecting the device’s operation.
IDCODE: When the IDCODE instruction is latched into
the parallel instruction register, the identification data
register is selected. The device identification code is
loaded into the identification data register on the rising
edge of TCK following entry into the capture-DR state.
Shift-DR can be used to shift the identification code out
serially through TDO. During test-logic-reset, the IDCODE
instruction is forced into the instruction register. The iden-
tification code always has a ‘1’ in the LSB position. The
next 11 bits identify the manufacturer’s JEDEC number
and number of continuation bytes followed by 16 bits for
the device and 4 bits for the version. See Table 31.
USERCODE: When the USERCODE instruction latches
into the parallel instruction register, the user-code data
register is selected. The device user-code loads into the
user-code data register on the rising edge of TCK fol-
lowing entry into the capture-DR state. Shift-DR can be
used to shift the user-code out serially through TDO. See
Table 32. This instruction can be used to help identify
multiple MAX16065/MAX16066 devices connected in a
JTAG chain.
LOAD ADDRESS: This is an extension to the standard
IEEE 1149.1 instruction set to support access to the
memory in the MAX16065/MAX16066. When the LOAD
ADDRESS instruction latches into the instruction register,
TDI connects to TDO through the 8-bit memory address
test data register during the shift-DR state.
READ DATA: This is an extension to the standard IEEE
1149.1 instruction set to support access to the memory
in the MAX16065/MAX16066. When the READ DATA
instruction latches into the instruction register, TDI con-
nects to TDO through the 8-bit memory read test data
register during the shift-DR state.
WRITE DATA: This is an extension to the standard IEEE
1149.1 instruction set to support access to the memory
in the MAX16065/MAX16066. When the WRITE DATA
instruction latches into the instruction register, TDI con-
nects to TDO through the 8-bit memory write test data
register during the shift-DR state.
REBOOT: This is an extension to the standard IEEE
1149.1 instruction set to initiate a software-controlled
reset to the MAX16065/MAX16066. When the REBOOT
instruction latches into the instruction register, the
MAX16065/MAX16066 resets and immediately begins
the boot-up sequence.
48
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| MAX16066ETL+ | 功能描述:监控电路 8Ch Power Supply Sequencer RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16066ETL+T | 功能描述:监控电路 8Ch Power Supply Sequencer RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16067ETJ+ | 功能描述:监控电路 6Ch System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16067ETJ+T | 功能描述:监控电路 6Ch System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16067EVKIT+ | 功能描述:监控电路 6-Channel System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
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