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| 型号： | MAX16067ETJ+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/48页 |
| 文件大小： | 0K |
| 描述： | IC SYSTEM MANAGER 6CH 32-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 60 |
| 应用： | 电源监控器，序列发生器 |
| 电源电压： | 2.8 V ~ 14 V |
| 电流 - 电源： | 2.8mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-WFQFN 裸露焊盘 |
| 供应商设备封装： | 32-TQFN-EP（5x5） |
| 包装： | 管件 |
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6-Channel, Flash-Configurable System Manager
with Nonvolatile Fault Registers
ABSOLUTE MAXIMUM RATINGS
V CC to GND ............... ……………………………….-0.3V to +15V
MON_, SCL, SDA, A0 to GND ................................-0.3V to +6V
EN, TCK, TMS, TDI to GND ....................................-0.3V to +4V
TDO to GND ............................................-0.3V to (V DBP + 0.3V)
EN_OUT1, EN_OUT2, EN_OUT3
(configured as open-drain) to GND ..................-0.3V to +15V
EN_OUT1, EN_OUT2, EN_OUT3
(configured as charge pump) to GND ..............-0.3V to +15V
EN_OUT4, EN_OUT5, EN_OUT6, RESET, GPIO_
(configured as open-drain) to GND. ....................-0.3V to +6V
EN_OUT_, RESET, GPIO_ (configured as push-pull)
to GND .................................................-0.3V to (V DBP + 0.3V)
DBP, ABP to GND .......................................-0.3V to minimum of
(4V and (V CC + 0.3V))
Continuous Current (all other pins) ................................. Q 20mA
Continuous Current (GND, pin 5).................................... Q 30mA
Continuous Power Dissipation (T A = +70 N C)
32-Pin TQFN (derate 34.5mW/ N C above +70 N C) ..... 2759mW*
Thermal Resistance (Note 1)
B JA ................................................................................29 N C/W
B JC .................................................................................2 N C/W
Operating Temperature Range .......................... -40 N C to +85 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
*As per JEDEC 51 Standard, Multilayer Board (PCB).
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V CC = 2.8V to 14V, T A = T J = -40 N C to +85 N C, unless otherwise specified. Typical values are at V ABP = V DBP = V CC = 3.3V,
T A = +25 N C.) (Note 2)
PARAMETER
Operating Voltage Range
Undervoltage Lockout
SYMBOL
V CC
V UVLO
CONDITIONS
RESET output asserted low
Minimum voltage on V CC to ensure the
device is flash configurable
MIN
1.2
2.8
TYP
MAX
14
2.7
UNITS
V
V
Undervoltage Lockout Hysteresis
UVLO HYS
55
mV
Minimum Flash Operating Voltage
V FLASH
I CC1
Minimum voltage on V CC to ensure flash
erase and write operations
No load on any output
2.7
2.8
4
V
Supply Current
I CC2
No load on any output, during flash writing
cycle
7.7
14
mA
V CC = V ABP = V DBP = 3.6V (Note 3)
5
DBP Regulator Voltage
ABP Regulator Voltage
Boot Time
V DBP
V ABP
t BOOT
V CC = 5V, C DBP = 1 F F, no loa d
V CC = 5V, C ABP = 1 F F, no loa d
V CC > V UVLO
2.8
2.85
3
3
100
3.2
3.15
200
V
V
F s
Flash Writing Time
8-byte word
122
ms
Internal Timing Accuracy
(Note 4)
-10
+10
%
ADC
Resolution
10
Bits
Gain Error
Offset Error
Integral Nonlinearity
ADC GAIN
ADC OFF
ADC INL
T A = +25 N C
T A = -40 N C to +85 N C
0.35
0.75
1.50
1
%
LSB
LSB
2
______________________________________________________________________________________
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX16067ETJ+ | 功能描述:监控电路 6Ch System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16067ETJ+T | 功能描述:监控电路 6Ch System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16067EVKIT+ | 功能描述:监控电路 6-Channel System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16068ETI+ | 功能描述:监控电路 6Ch System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16068ETI+T | 功能描述:监控电路 6Ch System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
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