参数资料
型号: MAX1840EUB+
厂商: Maxim Integrated Products
文件页数: 3/8页
文件大小: 0K
描述: IC TRANS LEVEL SIM 10-UMAX
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 50
应用: 智能卡
接口: MICROWIRE?,QSPI?,串行,SPI?
电源电压: 1.4 V ~ 5.5 V,1.7 V ~ 5.5 V
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-µMAX
包装: 管件
安装类型: 表面贴装
产品目录页面: 1410 (CN2011-ZH PDF)
MAX1840/MAX1841
Low-Voltage SIM/Smart Card
Level Translators in MAX
_______________________________________________________________________________________
3
ELECTRICAL CHARACTERISTICS (continued)
(Figure 1, DVCC = +1.8V; VCC = +1.8V, +3.0V, or +5.0V; SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO = CCLK = CRST = CDATA = 30pF, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note1)
UNITS
CONDITIONS
MIN
TYP
MAX
SYMBOL
PARAMETER
Output Low Level
VOL(DATA)
IO = GND, ISINK = 100A
0.4
V
DVCC = 3.0V, IO = GND, ISINK = 200A
0.4
Output High Level
ISOURCE = 10A
0.7
DVCC
V
DVCC = 3.0V, ISOURCE = 20A
0.7
DVCC
VOH(DATA)
IO Pullup Resistance
RIO
Between IO and VCC
6.5
10
14
k
Input Low Threshold
VIL(IO)
IIL(MAX) = 1mA (Note 2)
0.3
V
Input High Threshold
VIH(IO)
IIH(MAX) = ±20A (Note 3)
0.7
VCC
V
Input Low Current
IIL
1
mA
Input High Current
IIH
20
A
Output Low Level
VOL(IO)
DATA = GND or DDRV = GND,
ISINK = 200A
0.4
V
Output High Level
VOH(IO)
ISOURCE = 20A
0.8
VCC
V
Shutdown Output Levels
(IO, CLK, RST)
ISINK = 200A, SHDN = GND, DATA = CIN =
RIN = DVCC (MAX1840 only)
0.4
V
ISINK = 200A, DVCC = GND, SHDN
(MAX1840) = DDRV (MAX1841) = DATA =
CIN = RIN = DVCC
0.4
V
ISINK = 200A, VCC = GND, SHDN
(MAX1840) = DDRV (MAX1841) = DATA =
CIN = RIN = DVCC
0.4
V
Maximum CLK Frequency
(Notes 4, 5)
fCLK
VCC = 2.7V to 5.5V, DVCC = 1.4V to 2.7V
520
MHz
VCC = 1.7V to 3.6V, DVCC = 1.4V to 2.25V
515
IO (INPUT/OUTPUT)
SHUTDOWN OUTPUT LEVELS
TIMING
Note 1: Specifications to -40°C are guaranteed by design, not production tested.
Note 2: VIL is defined as the voltage at which the output (DATA/IO) voltage equals 0.5V.
Note 3: VIH is defined as the voltage at which the output (DATA/IO) voltage exceeds the input (IO/DATA) voltage by 100mV.
Note 4: Timing specifications are guaranteed by design, not production tested.
Note 5: The maximum CLK frequency is defined as the output duty cycle remaining in the 40% to 60% range when the 50% CIN is
applied. CIN has 5ns rise and fall times; levels are GND to DVCC. Input and output levels are measured at 50% of the waveform.
相关PDF资料
PDF描述
VI-BTH-IX-F2 CONVERTER MOD DC/DC 52V 75W
DS8023-RJX+ IC INTERFACE SMART CARD 28-TSSOP
VI-BTH-IX-F1 CONVERTER MOD DC/DC 52V 75W
VI-BTH-IW-F3 CONVERTER MOD DC/DC 52V 100W
NCN6000DTBR2 IC INTERFACE SMART CARD 20TSSOP
相关代理商/技术参数
参数描述
MAX1840EUB+ 功能描述:转换 - 电压电平 SIM/Smart-Card Level Translator RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8
MAX1840EUB+T 功能描述:转换 - 电压电平 SIM/Smart-Card Level Translator RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8
MAX1840EUB-T 功能描述:转换 - 电压电平 SIM/Smart-Card Level Translator RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8
MAX1841EUB 功能描述:转换 - 电压电平 SIM/Smart-Card Level Translator RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8
MAX1841EUB+ 功能描述:转换 - 电压电平 SIM/Smart-Card Level Translator RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8