参数资料
型号: MAX1956ETI+T
厂商: Maxim Integrated Products
文件页数: 9/22页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM VM 28-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
PWM 型: 电压模式
输出数: 2
频率 - 最大: 660kHz
占空比: 97%
电源电压: 1.6 V ~ 5.5 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 28-WFQFN 裸露焊盘
包装: 带卷 (TR)
1.6V to 5.5V Input, 0.5% Accurate, Dual
180° Out-of-Phase Step-Down Controllers
Pin Description (continued)
PIN
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Exposed
Pad
NAME
EN
ILIM1
FB1
COMP1
GND1
REF
GND
COMP2
FB2
ILIM2
AV DD
SEQ
BST2
DH2
LX2
DL2
PGND2
IN
V DD2
LXB
PGND
V DD1
PGND1
FUNCTION
Enable and Voltage Margining Input. Connect EN to IN for normal operation or connect to GND for shutdown.
Set V EN = (1/3)V IN to set the outputs to -4% of nominal. Set V EN = (2/3)V IN to set the outputs to +4% of
nominal (see the Shutdown and Output Voltage Margining (EN) section).
Current-Limit Adjust. Sets the threshold for current sensing across the low-side MOSFET ’ s R DS(ON) . Connect
ILIM1 to AV DD for a 150mV threshold. For adjustable constant current or foldback current-limit setting, see
the Current Limit section.
Feedback Input. Connect to a voltage-divider from the output to GND to set the output voltage (see the
Setting the Output Voltage section).
Compensation. Internally pulled to ground during shutdown (see the Compensation Design section).
Ground. Connect to the PC board analog ground plane. Connect PC board power ground plane and analog
ground plane with a single connection.
1.28V Reference. Connect a 0.22μF capacitor from REF to GND.
Ground. Connect to the PC board analog ground plane. Connect the PC board power ground plane and
analog ground plane with a single connection.
Compensation. Internally pulled to ground during shutdown (see the Compensation Design section).
Feedback Input. Connect to a voltage-divider from the output to GND to set the output voltage (see the
Setting the Output Voltage section).
Current-Limit Adjust. Sets the threshold for current sensing across the low-side MOSFET ’ s R DS(ON) . Connect
ILIM2 to AVDD for a 150mV threshold. For adjustable constant current or foldback current-limit setting, see
the Current Limit section.
Analog Supply Input. Connect a 10 ? resistor from V DD to AV DD and a 0.47μF capacitor from AV DD to GND.
Power-Sequence Input. Connect SEQ to GND to set OUT1 and OUT2 to power up and power down
simultaneously. Connect SEQ to IN to make OUT1 power up first and power down last.
High-Side MOSFET Gate-Driver Bootstrap Connection. Connect a capacitor from BST2 to LX2 and a Schottky
diode from V DD to BST2.
High-Side MOSFET Gate-Driver Output. Connect to the high-side MOSFET gate. DH2 is pulled low in
shutdown.
Inductor Connection. Connect to the switched side of the inductor.
Low-Side MOSFET Gate-Driver Output. Connect to the low-side MOSFET gate. DL2 is pulled low in shutdown.
Power Ground. Connect to the low-side MOSFET source for regulator 2 and PC board power ground plane.
Input Supply
Internal Boost Regulator Output. Connect to V DD1 , and bypass with a 10μF capacitor to GND.
Internal Boost Regulator Inductor Connection. Connect a 4.7μH inductor from LXB to IN. Internally shorted to
V DD2 in shutdown.
Power Ground. Connect to PC board power ground plane.
Internal Boost Regulator Output. Connect to V DD2 .
Power Ground. Connect to the low-side MOSFET source for regulator 1 and PC board power ground plane.
Exposed Pad. Solder to the PC board analog ground plane for optimum power dissipation.
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