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| 型号： | MAX19700ETM+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 19/32页 |
| 文件大小： | 0K |
| 描述： | IC ANLG FRONT END 7.5MSPS 48TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 43 |
| 位数： | 10 |
| 通道数： | 2 |
| 功率（瓦特）： | 36.3mW |
| 电压 - 电源，模拟： | 3V |
| 电压 - 电源，数字： | 3V |
| 封装/外壳： | 48-WFQFN 裸露焊盘 |
| 供应商设备封装： | 48-TQFN-EP（7x7） |
| 包装： | 管件 |
| 产品目录页面： | 1398 (CN2011-ZH PDF) |
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MAX19700
spurious emissions and preventing bus contention. In
TDD mode, the MAX19700 uses 38.4mW power in Rx
mode at fCLK = 7.5MHz, and 39.3mW in Tx mode.
TD-SCDMA Application
Figure 12 illustrates a typical TD-SCDMA application
circuit. The MAX19700 is designed to interface directly
with the MAX2507 and MAX2392 radio front-ends to
provide a complete “RF-to-Bits” front-end solution. The
MAX19700 provides several features that allow direct
interface to the MAX2392 and MAX2507:
Integrated Tx filters reduce component count,
lower cost, and meet TD-SCDMA spectral
mask requirements
Programmable DC common-mode Tx output levels
eliminate discrete DC level-shifting components
while preserving Tx DAC full dynamic range
Optimized Tx full-scale output level eliminates dis-
crete amplifiers for I/Q gain control
Tx-I/Q offset correction eliminates discrete trim
DACs for offset trim to improve sideband/carrier
suppression
One microsecond settling time aux-DACs for VGA
and AGC control allow fast, accurate Tx power and
Rx gain control
Grounding, Bypassing, and
Board Layout
The MAX19700 requires high-speed board layout
design techniques. Refer to the MAX19700 EV kit data
sheet for a board layout reference. Place all bypass
capacitors as close to the device as possible, prefer-
ably on the same side of the board as the device, using
surface-mount devices for minimum inductance.
Bypass VDD to GND with a 0.1F ceramic capacitor in
parallel with a 2.2F capacitor. Bypass OVDD to OGND
with a 0.1F ceramic capacitor in parallel with a 2.2F
capacitor. Bypass REFP, REFN, and COM each to
GND with a 0.33F ceramic capacitor. Bypass REFIN
to GND with a 0.1F capacitor.
Multilayer boards with separated ground and power
planes yield the highest level of signal integrity. Use a
split ground plane arranged to match the physical loca-
tion of the analog ground (GND) and the digital output
driver ground (OGND) on the device package. Connect
the MAX19700 exposed backside paddle to GND
plane. Join the two ground planes at a single point so
the noisy digital ground currents do not interfere with
the analog ground plane. The ideal location for this
connection can be determined experimentally at a
point along the gap between the two ground planes.
7.5Msps, Ultra-Low-Power
Analog Front-End
26
______________________________________________________________________________________
Figure 9. Balun Transformer-Coupled Differential-to-Single-
Ended Output Drive for Tx DAC
MAX19700
IDP
IDN
VOUT
QDP
QDN
VOUT
Figure 10. Single-Ended Drive for Rx ADC
MAX19700
0.1F
1k
100
CIN
22pF
CIN
22pF
QAP
QAN
COM
IAP
IAN
0.1F
RISO
50
RISO
50
REFP
REFN
VIN
0.1F
1k
100
CIN
22pF
CIN
22pF
0.1F
RISO
50
RISO
50
REFP
REFN
VIN
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX19700ETM+ | 功能描述:ADC / DAC多通道 7.5Msps CODEC/AFE 1.8/2.7-3.3V RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19700ETM+T | 功能描述:ADC / DAC多通道 7.5Msps CODEC/AFE 1.8/2.7-3.3V RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19700ETM-T | 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19700EVCMOD2 | 功能描述:ADC / DAC多通道 Evaluation Kit/Evaluation System for the MAX19700 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19700EVKIT | 功能描述:数据转换 IC 开发工具 RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
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