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| 型号： | MAX2079CXE+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/49页 |
| 文件大小： | 0K |
| 描述： | IC OCT ULTRASOUND RCVR 144CTBGA |
| 标准包装： | 1,000 |
| 系列： | * |
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Low-Power, High-Performance, Fully Integrated
Octal Ultrasound Receiver (Octal LNA, VGA,
AAF, ADC, and CWD Beamformer)
MAX2079
2
Maxim Integrated
VCC3, VCC5 to GND..............................................-0.3V to +5.5V
AVDD, OVDD to GND ..........................................-0.3V to +2.1V
VCC5 - VCC3 ................................................................... > -0.3V
VREF, LO+/-, GC+/- to GND....................-0.3V to (VCC3 + 0.3V)
CI+/-, CQ+/- to GND .............................................-0.3V to +13V
ZF_, IN_, AG to GND...............................-0.3V to (VCC5 + 0.3V)
INC_...........................................................................±20mA DC
IN_ to AG..............................................................-0.6V to +0.6V
REFIO, CLKIN+/-, LOON to
GND........... -0.3V to the lower of (VAVDD + 0.3V) and +2.1V
OUT+/-, SDIO, SCLK, CS, CLKOUT+/-, FRAME+/-,
SHDN, CWD to GND .... -0.3V to the lower of (VOVDD + 0.3V)
and +2.1V
CI+/-, CQ+/-, VCC5, VCC3, AVDD/OVDD, VREF analog and
digital control signals must be applied in this order.
Input Differential Voltage............................... 2.0VP-P differential
Continuous Power Dissipation (TA = +70NC)
144-Bump CTBGA (derate 33.3mW/NC above +70NC)....3200mW
Operating Case Temperature Range (Note 1) ....0NC to +70NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -40NC to +150NC
Soldering Temperature (reflow) ......................................+260NC
Junction-to-Ambient Thermal Resistance (
qJA) ..............25°C/W
Junction-to-Case Thermal Resistance (
qJC)..................7.7°C/W
ABSOLUTe MAxIMUM RATINGS
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Note 1: TC is the temperature on the bump of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACkAGe THeRMAL CHARACTeRISTICS (Note 2)
OCTAL ULTRASOUND FRONT-eND SPeCIFICATIONS
DC eLeCTRICAL CHARACTeRISTICS—VGA MODe (CWD BeAMFORMeR OFF)
(VREF = 2.5V, VCC3 = 3.13V to 3.47V, VCC5 = 4.5V to 5.25V, VAVDD = VOVDD = 1.7V to 1.9V, TA = 0NC to +70NC, VGND = 0V, SHDN = 0,
CWD = 0, LOON = 0, fRF = 5MHz, 50mVP-P, ADC fCLK = 50Msps, digital HPF set to 60/64, two poles, 15/16 digital gain, VGC+ -
VGC- = -3V (minimum gain), high LNA gain. Typical values are at VREF = 2.5V, VCC3 = 3.3V, VCC5 = 4.75V, VAVDD = VOVDD = 1.8V,
VGC+ - VGC- = 0V, TA = +25NC, unless otherwise noted.) (Note 3)
PARAMeTeR
SYMBOL
CONDITIONS
MIN
TYP
MAx
UNITS
3.3V Supply Voltage
VCC3
VCC3 pins
3.13
3.3
3.47
V
5V Supply Voltage
VCC5
VCC5 pins
4.5
4.75
5.25
V
1.8V Supply Voltage
VCC1.8
AVDD and OVDD pins
1.7
1.8
1.9
V
External Reference Voltage
Range
VREF
(Note 4)
2.475
2.525
V
External Reference Current
Total current into the VREF pin
5
F
A
3V Supply Current per Channel
ICC3
Total I divided by 8, VGC+ - VGC- = 0.4V
9.5
16
mA
5V Supply Current per Channel
ICC5
Total I divided by 8
6.4
9
mA
1.8V Supply Current
per Channel
ICC1.8
Total I divided by 8, AVDD + OVDD
32
37.9
mA
Total I divided by 8, AVDD
20
22.8
mA
Total I divided by 8, OVDD
12
15.1
mA
DC Power per Channel
P_NM
VGC+ - VGC- = -0.4V
120
mW
Differential Analog Control
Voltage Range
VGAIN_RANG VGC+ - VGC-
Q
3
V
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