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| 型号： | MAX3302EEWA+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/38页 |
| 文件大小： | 0K |
| 描述： | IC USB OTG TXRX/CHRG PUMP 25-WLP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 1/1 |
| 规程： | USB 2.0 |
| 电源电压： | 3 V ~ 4.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 25-WFBGA，WLCSP |
| 供应商设备封装： | 25-WLP |
| 包装： | 带卷 (TR) |
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MAX3301E/MAX3302E
USB On-the-Go Transceivers and Charge Pumps
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC = +3V to +4.5V, VL = +1.65V to +3.6V, CFLYING = 100nF, CVBUS = 1F, ESRCVBUS = 0.1Ω (max), TA = TMIN to TMAX, unless
otherwise noted. Typical values are at VCC = +3.7V, VL = +2.5V, TA = +25°C.) (Note 2)
Note 1: The UCSP package is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the
device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is
required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
All voltages are referenced to GND.
VCC, VL .....................................................................-0.3V to +6V
TRM (regulator off or supplied by VBUS) ..-0.3V to (VBUS + 0.3V)
TRM (regulator supplied by VCC)...............-0.3V to (VCC + 0.3V)
D+, D- (transmitter tri-stated) ...................................-0.3V to +6V
D+, D- (transmitter functional)....................-0.3V to (VCC + 0.3V)
VBUS .........................................................................-0.3V to +6V
ID_IN, SCL, SDA.......................................................-0.3V to +6V
INT, SPD, RESET, ADD, OE/INT, RCV, VP,
VM, SUS, DAT_VP, SE0_VM ......................-0.3V to (VL + 0.3V)
C+.............................................................-0.3V to (VBUS + 0.3V)
C-................................................................-0.3V to (VCC + 0.3V)
Short-Circuit Duration, VBUS to GND .........................Continuous
Continuous Power Dissipation (TA = +70°C)
25-Bump WLP (derate 12.2mW/°C above +70°C).......976mW
25-Bump UCSP (derate 12.2mW/°C above +70°C) ....976mW
32-Pin TQFN (5mm x 5mm x 0.8mm) (derate 21.3mW/°C
above +70°C).........................................................1702mW
28-Pin TQFN (4mm x 4mm x 0.8mm) (derate 20.8mW/°C
above +70°C).........................................................1666mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Reflow Temperature (Note 1)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) .......................................................+215°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
3.0
4.5
V
TRM Output Voltage
VTRM
3.0
3.6
V
Logic Supply Voltage
VL
1.65
3.60
V
VL Supply Current
IVL
I2C interface in steady state
5
A
VCC Operating Supply Current
ICC
USB normal mode, CL = 50pF, device
switching at full speed
10
mA
VVBUS_DRV = 1, IVBUS = 0
1.4
2
VCC Supply Current During Full-
Speed Idle
VVBUS_DRV = 0, D+ = high, D- = low
0.5
0.8
mA
VCC Shutdown Supply Current
ICC(SHDN)
3.5
10
A
VCC Interrupt Shutdown Supply
Current
ICC(ISHDN) ID_IN unconnected or high
20
30
A
VCC Suspend Supply Current
USB suspend mode, ID_IN unconnected or high
170
500
A
LOGIC I/O
RCV, DAT_VP, SE0_VM,
INT,
OE/INT, VP, VM Output High
Voltage
VOH
IOUT = 1mA (sourcing)
VL - 0.4
V
RCV, DAT_VP, SE0_VM,
INT,
OE/INT, VP, VM Output Low
Voltage
VOL
IOUT = 1mA (sinking)
0.4
V
OE/INT, SPD, SUS, RESET,
DAT_VP, SE0_VM Input High
Voltage
VIH
2/3 x VL
V
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| MAX3311CUB | 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| MAX3311CUB+ | 功能描述:RS-232接口集成电路 460kbps 1uA Transceiver RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| MAX3311CUB+T | 功能描述:RS-232接口集成电路 460kbps 1uA Transceiver RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| MAX3311CUB-T | 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| MAX3311ECUB | 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
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