参数资料
型号: MAX3302EEWA+T
厂商: Maxim Integrated Products
文件页数: 21/38页
文件大小: 0K
描述: IC USB OTG TXRX/CHRG PUMP 25-WLP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 收发器
驱动器/接收器数: 1/1
规程: USB 2.0
电源电压: 3 V ~ 4.5 V
安装类型: 表面贴装
封装/外壳: 25-WFBGA,WLCSP
供应商设备封装: 25-WLP
包装: 带卷 (TR)
MAX3301E/MAX3302E
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
Human Body Model
Figure 22 shows the Human Body Model and Figure 23
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
1.5kΩ resistor.
IEC 61000-4-2
The IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3301E/
MAX3302E helps the user design equipment that meets
level 3 of IEC 61000-4-2, without the need for additional
ESD-protection components. The major difference
between tests done using the Human Body Model and
IEC 61000-4-2 is a higher peak current in IEC 61000-4-2,
due to the fact that series resistance is lower in the IEC
61000-4-2 model. Hence, the ESD-withstand voltage
measured to IEC 61000-4-2 is generally lower than that
measured using the Human Body Model. Figure 24
shows the IEC 61000-4-2 model. The Air-Gap Discharge
test involves approaching the device with a charged
probe. The contact discharge method connects the
probe to the device before the probe is energized.
Figure 25 shows the IEC 61000-4-2 current waveform.
Layout Considerations
The MAX3301E/MAX3302E high operating frequency
makes proper layout important to ensure stability and
maintain the output voltage under all loads. For best
performance, minimize the distance between the
bypass capacitors and the MAX3301E/MAX3302E. Use
symmetric trace geometry from D+ and D- to the USB
connector.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech-
niques, bump-pad layout, and the recommended reflow
temperature profile, as well as the latest information on
reliability testing results, refer to the Application Note:
Understanding the Basics of the Wafer-Level Chip-Scale
Package (WL-CSP) available on Maxim’s website at
www.maxim-ic.com/ucsp.
USB On-the-Go Transceivers and Charge Pumps
28
______________________________________________________________________________________
BIT NUMBER
SYMBOL
CONTENTS
VALUE AT
POWER-UP
0
sdwn
Set to 0 to enable shutdown mode. Set to 1 for normal operation. Only the I2C
interface remains active in shutdown.
1
irq_mode
Set to 0 to set
INT and OE/INT as open-drain outputs. Set to 1 to set INT and
OE/INT as push-pull outputs.
0
2
xcvr_input_disc
Set to 0 to leave the D+/D- single-ended receiver inputs connected. Set to 1 to
disconnect the D+/D- receiver inputs to reduce power consumption in audio mode.
0
3
reg_sel
Set to 0 to power TRM from VCC. Set to 1 to power TRM from VBUS.0
4–7
Reserved. Set to 0 for normal operation.
0000
Table 16. MAX3302E Special-Function Register 2 (Write to Address 10h or 16h to Set,
Write to Address 11h or 17h to Clear)
REGISTER
ADDRESS
CONTENTS
00h
6Ah
Vendor ID
01h
0Bh
02h
01h
Product ID
03h
33h
14h
77h
Revision ID
15h
41h
Table 17. ID Registers
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