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| 型号： | MAX3421EETJ+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 25/28页 |
| 文件大小： | 0K |
| 描述： | IC USB PERIPH/HOST CNTRL 32TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 60 |
| 控制器类型： | USB 外设控制器 |
| 接口： | USB/串行 |
| 电源电压： | 3 V ~ 3.6 V |
| 电流 - 电源： | 15mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-WFQFN 裸露焊盘 |
| 供应商设备封装： | 32-TQFN-EP（5x5） |
| 包装： | 托盘 |
| 产品目录页面： | 1407 (CN2011-ZH PDF) |
| 配用： | MAX3421EVKIT-1+-ND - EVAL KIT FOR MAX3421E |
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MAX3421E
USB Peripheral/Host Controller
with SPI Interface
6
Maxim Integrated
Pin Description (continued)
PIN
NAME
INPUT/
OUTPUT
FUNCTION
21
D+
Input/
Output
USB D+ Signal. Connect D+ to a USB connector through a 33
Ω ±1% series resistor. A
switchable 1.5k
Ω D+ pullup resistor and 15kΩ D+ pulldown resistor is internal to the device.
22
VBCOMP
Input
VBUS Comparator Input. VBCOMP is internally connected to a voltage comparator to allow the
SPI master to detect (through an interrupt or checking a register bit) the presence or loss of
power on VBUS. Bypass VBCOMP to ground with a 1.0F ceramic capacitor. VBCOMP is pulled
down to ground with RIN (see Electrical Characteristics).
23
VCC
Input
USB Transceiver and Logic Core Power-Supply Input. Connect VCC to a positive 3.3V power
supply. Bypass VCC to ground with a 1.0F ceramic capacitor as close to the VCC pin as possible.
24
XI
Input
Crystal Oscillator Input. Connect XI to one side of a parallel resonant 12MHz ±0.25% crystal
and a load capacitor to GND. XI can also be driven by an external clock referenced to VCC.
25
XO
Output
Crystal Oscillator Output. Connect XO to the other side of a parallel resonant 12MHz ±0.25% crystal
and a load capacitor to GND. Leave XO unconnected if XI is driven with an external source.
26
GPIN0
27
GPIN1
28
GPIN2
29
GPIN3
30
GPIN4
31
GPIN5
32
GPIN6
Input
General-Purpose Inputs. GPIN7–GPIN0 are connected to VL with internal pullup resistors.
GPIN7–GPIN0 logic levels are referenced to the voltage on VL.
—
EP
Input
Exposed Pad, Connected to Ground. Connect EP to GND or leave unconnected. EP is located on
the bottom of the TQFN package. The TQFP package does not have an exposed pad.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX3421EETJ+ | 功能描述:外围驱动器与原件 - PCI USB Peripheral Controller w/SPI RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
| MAX3421EETJ+T | 功能描述:外围驱动器与原件 - PCI USB Peripheral Controller w/SPI RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
| MAX3421EVKIT-1+ | 功能描述:界面开发工具 MAX3421E/20E Eval Kit RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| MAX3430CPA | 功能描述:RS-485接口IC RoHS:否 制造商:Texas Instruments 数据速率:250 Kbps 工作电源电压:3.3 V 电源电流:750 uA 工作温度范围:- 40 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| MAX3430CPA+ | 功能描述:RS-485接口IC Fail-Safe 1/4-Unit 3.3V Transceiver RoHS:否 制造商:Texas Instruments 数据速率:250 Kbps 工作电源电压:3.3 V 电源电流:750 uA 工作温度范围:- 40 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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