参数资料
型号: MAX3946ETG+T
厂商: Maxim Integrated
文件页数: 2/29页
文件大小: 0K
描述: IC LASER DVR SFP 11.3GBPS 24TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 激光二极管驱动器
数据速率: 11.3Gbps
通道数: 1
电源电压: 2.85 V ~ 3.63 V
电流 - 电源: 68mA
电流 - 调制: 80mA
电流 - 偏置: 80mA
工作温度: -40°C ~ 85°C
封装/外壳: 24-WFQFN 裸露焊盘
供应商设备封装: 24-TQFN-EP(4x4)
包装: 带卷 (TR)
安装类型: 表面贴装
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
ABSOLUTE MAXIMUM RATINGS
V CC , V CCT , V CCD ................................................-0.3V to +4.0V
Current Into TOUT+ and TOUT-.................................... +100mA
Current Into TIN+ and TIN- ............................. -20mA to +20mA
Voltage Range at TIN+, TIN-,
DISABLE, SDA, SCL, CSEL, FAULT,
BMAX, and BMON................................ -0.3V to (V CC + 0.3V)
Voltage Range at BIAS........................................................-0.3V to V CC
Voltage Range at TOUT+ and TOUT- ....(V CC - 1.3V) to (V CC + 1.3V)
Current into BIAS.........................................................................+130mA
Continuous Power Dissipation (T A = +70 N C)
TQFN (derate 27.8mW/ N C above +70 N C)..................2222mW
Storage Temperature Range .......................... -55 N C to +150 N C
Die Attach Temperature .................................................+400 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance ( q JA ) ..........36°C/W
Junction-to-Case Thermal Resistance ( q JC ) .................3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V CC = +2.85V to +3.63V, T A = -40°C to +85°C, and Figure 1. Guaranteed by design and characterization from T A = -40°C to +95°C.
Typical values are at V CC = +3.3V, I BIAS = 60mA, I MOD = 40mA, 25 I differential output load, and T A = +25°C, unless otherwise
noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
T Y P
MAX
UNITS
POWER SUPPLY
Power-Supply Current
Power-Supply Voltage
Power-Supply Noise
I CC
V CC
Excludes output current through the exter-
nal pullup inductors (Note 3)
DC to 10MHz
10MHz to 20MHz
2.85
68
90
3.63
100
10
mA
V
mV P-P
POWER-ON RESET
V CC for Enable High
2 .5 5
2.75
V
V CC for Enable Low
2.3
2 .4 5
V
DATA INPUT SPECIFICATION
Input Data Rate
1
10
11.3
Gbps
Differential Input Voltage
V IN
TXEQ_EN = high, launch amplitude into
FR4 transmission line P 5.5in
0.19
0.7
V P-P
TXEQ_EN = low
0.15
1.0
Differential Input Resistance
Differential Input Return Loss
Common-Mode Input Return
Loss
R IN
SDD11
SCC11
Part powered on, f P 10GHz
Part powered on, 1GHz P f P 10GHz
75
100
12
10
125
I
dB
dB
BIAS GENERATOR
Maximum Bias Current
I BIASMAX
Current into BIAS pin, DISABLE = low, and
TX_EN = high
80
mA
2
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