参数资料
| 型号： | MAX3946ETG+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 25/29页 |
| 文件大小： | 0K |
| 描述： | IC LASER DVR SFP 11.3GBPS 24TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 激光二极管驱动器 |
| 数据速率： | 11.3Gbps |
| 通道数： | 1 |
| 电源电压： | 2.85 V ~ 3.63 V |
| 电流 - 电源： | 68mA |
| 电流 - 调制： | 80mA |
| 电流 - 偏置： | 80mA |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 供应商设备封装： | 24-TQFN-EP（4x4） |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
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1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
V CCT
V CCT
TIN+
TIN-
50 I
50 I
CONTROL
LOOP
DEEMPHASIS
CONTROL
25 I
25 I
TOUT+
TOUT-
V CC D
V EET
V CC D
V EET
V CC D
FAULT
7.5k I
75k I
DISABLE
CLAMP
SDA
SCL, CSEL
75k I
V EET
V EET
Figure 6. Simplified I/O Structures
V EET
V EET
Layout Considerations
The data inputs and outputs are the most critical paths
for the device and great care should be taken to mini-
mize discontinuities on these transmission lines between
the connector and the IC. Here are some suggestions for
maximizing the performance of the IC:
? The data inputs should be wired directly between the
module connector and IC without stubs.
? The data transmission lines to the laser should be kept
as short as possible and be designed for 50 I differ-
ential or 25 I single-ended characteristic impedance.
? An uninterrupted ground plane should be positioned
beneath the high-speed I/Os.
? Ground path vias should be placed close to the IC and
the input/output interfaces to allow a return current
path to the IC and the laser.
? Maintain 100 I differential transmission line imped-
ance into the IC.
? Use good high-frequency layout techniques and mul -
tilayer boards with an uninterrupted ground plane to
minimize EMI and crosstalk.
Refer to the schematic and board layers of the MAX3946
Evaluation Kit (MAX3946EVKIT) for more information.
Exposed-Pad Package and
Thermal Considerations
The exposed pad on the 24-pin TQFN provides a very
low-thermal resistance path for heat removal from the IC.
The pad is also electrical ground on the IC and must be
soldered to the circuit board ground for proper thermal
and electrical performance. Refer to Application Note 862:
HFAN-08.1: Thermal Considerations of QFN and Other
Exposed-Paddle Packages for additional information.
______________________________________________________________________________________
25
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX3946EVKIT+ | 功能描述:激光驱动器 1.0625Gbps to 11.3Gbps SFP+ Laser Driver with Laser Impedance Mismatch Tolerance RoHS:否 制造商:Micrel 数据速率:4.25 Gbps 工作电源电压:3 V to 3.6 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:QFN-16 封装:Tube |
| MAX3948ETE+ | 制造商:Maxim Integrated Products 功能描述:10G QSFP+ LDD - Rail/Tube |
| MAX3948ETE+T | 制造商:Maxim Integrated Products 功能描述:10G QSFP+ LDD 制造商:Maxim Integrated Products 功能描述:10G QSFP+ LDD - Tape and Reel |
| MAX3949ETE+ | 制造商:Maxim Integrated Products 功能描述:1GBPS TO 11.3GBPS, SFP+ LASER DRIVER - Rail/Tube |
| MAX3949ETE+T | 制造商:Maxim Integrated Products 功能描述:1GBPS TO 11.3GBPS, SFP+ LASER DRIVER - Tape and Reel |
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