参数资料
型号: MAX5067ETH+T
厂商: Maxim Integrated Products
文件页数: 29/32页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM CM 44-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
PWM 型: 电流模式
输出数: 1
频率 - 最大: 1MHz
占空比: 90%
电源电压: 4.75 V ~ 28 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 44-WFQFN 裸露焊盘
包装: 带卷 (TR)
Dual-Phase, +0.6V to +3.3V Output Parallelable,
Average-Current-Mode Controllers
(f P ) at least a decade away from the crossover frequency
to achieve maximum phase margin.
Use the following equations to calculate C CF and C CFF :
7) Avoid long traces between the V CC bypass capaci-
tors, driver output of the MAX5065/MAX5067,
MOSFET gates and PGND pin. Minimize the loop
formed by the V CC bypass capacitors, bootstrap
C CF =
1
2 × π × f Z × R CF
(28)
diode, bootstrap capacitor, MAX5065/MAX5067,
and upper MOSFET gate.
8) Place the bank of output capacitors close to the load.
C CFF =
1
2 × π × f P × R CF
(29)
9) Distribute the power components evenly across the
board for proper heat dissipation.
PC Board Layout
Use the following guidelines to layout the switching
voltage regulator:
1) Place the V IN and V CC bypass capacitors close to
the MAX5065/MAX5067.
2) Minimize the area and length of the high-current
loops from the input capacitor, upper switching
MOSFET, inductor, and output capacitor back to
the input capacitor negative terminal.
3) Keep short the current loop from the lower-switch-
ing MOSFET, inductor, and output capacitor.
4) Place the Schottky diodes close to the lower
MOSFETs and on the same side of the PC board.
5) Keep the SGND and PGND isolated and connect
them at one single point close to the negative termi-
nal of the input-filter capacitor.
10) Provide enough copper area at and around the
switching MOSFETs, inductor, and sense resistors
to aid in thermal dissipation.
11) Use at least 4oz copper to keep the trace induc-
tance and resistance to a minimum. Thin copper PC
boards can compromise efficiency since high cur-
rents are involved in the application. Also, thicker
copper conducts heat more effectively, thereby
reducing thermal impedance.
Chip Information
TRANSISTOR COUNT: 5451
PROCESS: BiCMOS
Selector Guide
6) Run the current-sense lines CS+ and CS- very
close to each other to minimize the loop area.
Similarly, run the remote-voltage sense lines
SENSE+ and SENSE- close to each other. Do not
cross these critical signal lines through power cir-
cuitry. Sense the current right at the pads of the
current-sense resistors.
PART
MAX5065
MAX5067
OUTPUT
Adjustable +0.6V to +3.3V
Adjustable +0.8V to +3.3V with OVP, PGOOD,
Phase Failure Detector
______________________________________________________________________________________
29
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