- 您现在的位置：买卖IC网 > PDF目录14390 > MAX5099ATJ+ (Maxim Integrated Products)IC REG BUCK SYNC ADJ DL 32TQFN PDF资料下载
参数资料
| 型号： | MAX5099ATJ+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/27页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ DL 32TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 60 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 2 |
| 输出电压： | 0.8 V ~ 17.1 V |
| 输入电压： | 4.5 V ~ 19 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 200kHz ~ 2.2MHz |
| 电流 - 输出： | 1A，2A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-WFQFN 裸露焊盘 |
| 包装： | 管件 |
| 供应商设备封装： | 32-TQFN-EP（5x5） |
第1页当前第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页
Dual, 2.2MHz, Automotive Synchronous Buck
Converter with 80V Load-Dump Protection
ABSOLUTE MAXIMUM RATINGS
V+ to SGND............................................................-0.3V to +25V
V+ to IN_HIGH...........................................................-19V to +6V
IN_HIGH to SGND ..................................................-0.3V to +19V
IN_HIGH Maximum Input Current .......................................60mA
BYPASS to SGND..................................................-0.3V to +2.5V
GATE to V+.............................................................-0.3V to +12V
GATE to SGND .......................................................-0.3V to +36V
SGND to PGND .....................................................-0.3V to +0.3V
V L to SGND ..................-0.3V to the Lower of +6V or (V+ + 0.3V)
VDRV to SGND .........................................................-0.3V to +6V
BST1/VDD1, BST2/VDD2, DRAIN_,
PGOOD_ to SGND ..............................................-0.3V to +30V
ON/OFF to SGND ...............................-0.3V to (IN_HIGH + 0.3V)
BST1/VDD1 to SOURCE1,
BST2/VDD2 to SOURCE2......................................-0.3V to +6V
SOURCE_ to SGND................................................-0.6V to +25V
EN_ to SGND............................................................-0.3V to +6V
OSC, FSEL_1, COMP_, SYNC,
FB_ to SGND..............................................-0.3V to (V L + 0.3V)
DL_ to PGND ...........................................-0.3V to (VDRV + 0.3V)
SOURCE1, DRAIN1 Peak Current ..............................5A for 1ms
SOURCE2, DRAIN2 Peak Current ..............................3A for 1ms
V L , BYPASS to
SGND Short Circuit ................... Continuous, Internally Limited
Continuous Power Dissipation (T A = +70°C)
32-Pin TQFN-EP (derate 34.5mW/°C above +70°C)..2759mW
Package Junction-to-Ambient
Thermal Resistance ( θ JA ) (Note 1).............................29.0°C/W
Package Junction-to-Case
Thermal Resistance ( θ JC ) (Note 1) ..............................1.7°C/W
Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range ............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) ................................+300°C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specifications. For detailed information
on package thermal considerations refer to www.maxim-ic.com/thermal-tutorial .
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDRV = V L , V+ = V L = IN_HIGH = 5.2V or V+ = IN_HIGH = 5.2V to 19V, EN_ = V L , SYNC = GND, I VL = 0mA, PGND = SGND,
C BYPASS = 0.22μF (low ESR), C VL = 4.7μF (ceramic), C V+ = 1μF (low ESR), C IN_HIGH = 1μF (ceramic), R IN_HIGH = 3.9k Ω , R OSC = 10k Ω ,
T J = -40°C to +125°C, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SYSTEM SPECIFICATIONS
Input Voltage Range
V+ Operating Supply Current
V+ Standby Supply Current
V+
I Q
I V+STBY
V+ = IN_HIGH
V L = V+ = IN_HIGH, Figure 6 (Note 3)
V L unloaded, no switching, V FB_ = 1V
V EN_ = 0V, PGOOD_ unconnected,
V+ = V IN_HIGH = 14V
5.2
4.5
4.2
0.75
19
5.5
6.0
1.1
V
mA
mA
V OUT1 = 5V at 1.5A,
V+ = V L = 5.2V
86
Efficiency
η
V OUT2 = 3.3V at 0.75A,
V+ = 12V
85
%
OVERVOLTAGE PROTECTOR
f SW = 300kHz
V+ = 16V
85
IN_HIGH Clamp Voltage
IN_HIGH
I SINK = 10mA
19
20
21
V
IN_HIGH Clamp Load
Regulation
1mA < I SINK < 50mA
160
mV
IN_HIGH Supply Current
IN_HIGH Standby Supply
Current
I IN_HIGH
I IN_HIGHSTBY
V EN_ = V PGOOD_ = V GATE = 0V,
V IN_HIGH = V ON/OFF = 14V
V ON/OFF = 0V, V PGOOD_ = V+ =
unconnected, V IN_HIGH = 14V
270
7
600
9
μA
μA
V+ to IN_HIGH Overvoltage
Clamp
V OV
V OV = V+ - V IN_HIGH , I GATE = -1mA
1.20
1.85
2.50
V
2
_______________________________________________________________________________________
相关PDF资料 |
PDF描述 |
|---|---|
| EMM15DTMT-S189 | CONN EDGECARD 30POS R/A .156 SLD |
| LQW15AN40NG00D | INDUCTOR |
| VI-B5V-EX-F3 | CONVERTER MOD DC/DC 5.8V 75W |
| RCM40DCCI | CONN EDGECARD 80POS R/A .156 SLD |
| MAX6467US16D7+T | IC MPU/RESET CIRC 1.575V SOT143 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX5099ATJ+ | 功能描述:直流/直流开关转换器 Dual 2.2MHz Synch Buck Converter RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| MAX5099ATJ+T | 功能描述:直流/直流开关转换器 Dual 2.2MHz Synch Buck Converter RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| MAX5099EVKIT+ | 功能描述:电源管理IC开发工具 MAX5098A/99 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX509ACAP | 功能描述:数模转换器- DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX509ACAP+ | 功能描述:数模转换器- DAC 8-Bit 4Ch Precision DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
发布紧急采购，3分钟左右您将得到回复。