参数资料
型号: MAX5975BETE+T
厂商: Maxim Integrated Products
文件页数: 2/20页
文件大小: 0K
描述: IC REG CTRLR FLYBK ISO CM 16TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
PWM 型: 电流模式
输出数: 1
频率 - 最大: 600kHz
占空比: 84%
电源电压: 12 V ~ 24 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 16-WFQFN 裸露焊盘
包装: 带卷 (TR)
Current-Mode PWM Controllers with Frequency
Dithering for EMI-Sensitive Power Supplies
ABSOLUTE MAXIMUM RATINGS
IN to GND ..............................................................-0.3V to +26V
EN, NDRV to GND ......................................-0.3V to (V IN + 0.3V)
RT, FFB, COMP, SS, DCLMP, DITHER/SYNC
to GND .................................................................-0.3V to +6V
FB to GND ...............................................................-0.3V to +6V
CS, CSSC to GND ...................................................-0.8V to +6V
PGND to GND ......................................................-0.3V to +0.3V
Maximum Input/Output Current (continuous)
NDRV ............................................................................100mA
NDRV (pulsed for less than 100ns) .................................. Q 1A
Continuous Power Dissipation (T A = +70 N C) (Note 1)
16-Pin TQFN (derate 20.8mW/ N C above +70 N C) .......1666mW
Junction-to-Case Thermal Resistance ( B JC ) (Note 1)
16-Pin TQFN................................................................ +7 N C/W
Junction-to-Ambient Thermal Resistance ( B JA ) (Note 1)
16-Pin TQFN.............................................................. +48 N C/W
Operating Temperature Range .......................... -40 N C to +85 N C
Maximum Junction Temperature.....................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V IN = 12V (for MAX5975A, bring V IN up to 21V for startup), V CS = V CSSC = V DITHER/SYNC = V FB = V FFB = V DCLMP = V GND , V EN =
+2V, NDRV = SS = COMP = unconnected, R RT = 34.8k I , C IN = 1 F F, T A = -40 N C to +85 N C, unless otherwise noted. Typical values
are at T A = +25 N C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
UNDERVOLTAGE LOCKOUT/STARTUP (IN)
Bootstrap UVLO Wakeup Level
Bootstrap UVLO Shutdown
Level
V INUVR
V INUVF
V IN rising
V IN falling
MAX5975A
MAX5975B
19.1
9.4
6.65
19.8
9.8
7
20.4
10.25
7.35
V
V
IN Supply Current in
Undervoltage Lockout
IN Supply Current After Startup
I START
I C
V IN = +18V (for MAX5975A);
V IN = +9V (for MAX597BA),
when in bootstrap UVLO
V IN = +12V
100
1.8
150
3
F A
mA
ENABLE (EN)
Enable Threshold
V ENR
V ENF
V EN rising
V EN falling
1.17
1.09
1.215
1.14
1.26
1.19
V
Input Current
I EN
1
F A
OSCILLATOR (RT)
RT Bias Voltage
V RT
1.23
V
NDRV Switching Frequency
Range
NDRV Switching Frequency
Accuracy
f SW
100
-8
600
+8
kHz
%
Maximum Duty Cycle
D MAX
f SW = 250kHz
81
82.5
84
%
2
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