参数资料
型号: MAX5980GTJ+T
厂商: Maxim Integrated
文件页数: 2/49页
文件大小: 0K
描述: IC CTRLR PD IEEE 802.3AF 32TQFN
标准包装: 2,500
类型: 以太网供电控制器 PD 开关(PoE)
应用: 供电设备(PSE)
内部开关: *
电流限制: *
电源电压: *
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 32-WFQFN 裸露焊盘
供应商设备封装: 32-TQFN-EP(5x5)
包装: 带卷 (TR)
Quad, IEEE 802.3at/af PSE Controller
for Power-over-Ethernet
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to V EE , unless otherwise noted.)
AGND ....................................................................-0.3V to +80V
DGND, SVEE_ ......................................................-0.3V to +0.3V
V DD ........................ -0.3V to the lower (V AGND + 0.3V) and +4V
OUT_ ....................................................-0.3V to (V AGND + 0.3V)
GATE_, SENSE_ ....................................................-0.3V to +22V
A3, A2, A1, A0, MIDSPAN, EN_CL5, AUTO,
INT , SCL, SDAIN, SDAOUT, EN to DGND ..........-0.3V to +6V
Maximum Current into INT and OUT .................................20mA
Maximum Current into OUT_ .......................Internally Regulated
Continuous Power Dissipation (T A = +70 N C)
32-Pin TQFN (derate 34.5mW/ N C above +70 N C) ....2758.6mW
Package Thermal Resistance (Note 1)
B JA ............................................................................. +29 N C/W
B JC ........................................................................... +1.7 N C/W
Operating Temperature Range ........................ -40 N C to +105 N C
Storage Temperature Range............................ -65 N C to +150 N C
Junction Temperature .....................................................+150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V AGND = 32V to 60V, V EE = V DGND = 0V, T A = -40 N C to +105 N C. All voltages are referenced to V EE , unless otherwise noted. Typical
values are at V AGND = 54V, T A = +25 N C, and default register settings. Currents are positive when entering the pin, and negative
otherwise.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLIES
Operating Voltage Range
V AGND
V AGND - V EE
32
60
V
V OUT_ = V SENSE_ = V EE ; INT , SDAOUT,
Supply Currents
I EE
and all logic inputs unconnected;
V SCL = V SDAIN = V DD ; measured at AGND
5
7
mA
in power mode after GATE_ pullup
GATE DRIVER AND CLAMPING
GATE_ Pullup Current
GATE_ Pulldown Current
Strong Pulldown Current
External Gate Drive
I PU
I PDW
I PDS
V GS
Power mode, gate drive on, V GATE_ = V EE
Port SHDN mode enabled;
V GATE_ = V EE + 10V
V SENSE_ = 500mV, V G ATE_ = V EE + 2V
V GATE_ - V EE , powe r mode, gate-drive on
-40
8.5
-50
40
25
9.5
-60
10.5
F A
F A
mA
V
CURRENT LIMIT AND OVERCURRENT
I LIM_ register
Maximum V SENSE_
allowed during
set to 80h,
Class 0–3
I LIM_ register
101
106.25
111.5
Current-Limit Clamp Voltage
V SU_LIM
current-limit
set to C0h,
200
212.5
225
mV
conditions,
V OUT_ = 0V (Note 3)
Class 4
I LIM_ register
set to C0h,
405
430
455
Class 5
2
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