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参数资料
| 型号： | MAX8672ETD+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 15/17页 |
| 文件大小： | 0K |
| 描述： | IC MANAGE NIMH BACKUP 14-TDFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | 备份管理 |
| 电池化学： | 镍金属氢化物 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-WFDFN 裸露焊盘 |
| 供应商设备封装： | 14-TDFN-EP（3x3） |
| 包装： | 带卷 (TR) |
Complete Backup Management
IC for NiMH Batteries
Applications Information
R8
Typical Application Circuit
Figure 6 displays the MAX8672 typical application circuit
for 2-cell NiMH applications. Corresponding to the
requirements for 2-cell NiMH batteries, maximum charge
voltage is programmed for 3.0V and the UVLO threshold
is set to 1.6V. The LDO output voltage is 1.75V. Standard
C1
0.047 μ F
2.7V TO 5.5V INPUT
C2
0.1 μ F
CT
IN
THRM
7.5k Ω
TH1
100k Ω
AT +25 ° C
CHGV
charge provides 2mA of standard charge current, while
trickle charge is programmed to provide 500μA of trickle
charge current. A 7.5k Ω resistor is connected in series
with the thermistor to program a hot temperature thresh-
old of +50°C and a cold temperature threshold of -0.6°C.
Layout Guidelines
C6
0.22 μ F
R1
100 Ω
R2
50k Ω
R3
200k Ω
DR
CHGI
TRKI
MAX8672
FBL
R6
57.6k Ω
R4
250k Ω
Careful PCB layout is important for minimizing ground
bounce and noise. Ensure that C2 (IN input capacitor),
C3 (BATT input capacitor), C4 (BST bypass capacitor),
and C5 (LDO output capacitor) are placed as close as
possible to the IC. Avoid using vias to connect C3 or
C4 to their respective pins or GND. C3 and C4 grounds
should be located next to each other, and this connec-
tion can then be used as the star ground point. All other
grounds should connect to the star ground. Connect
EP to the bottom layer ground plane, and then connect
the ground plane to the star ground. Vias on the induc-
2-CELL
NiMH
L1
4.7 μ H
C3
47 μ F
R9
100k Ω
BATT
UV
GND
LX
LDO
BST
R5
100k Ω
1.75V
C5
0.47 μ F
3.05V
C4
22 μ F
tor path are acceptable, if necessary. IN, BATT, BST,
and LDO traces should be as wide as possible to mini-
mize inductance. Refer to the MAX8672 evaluation kit
Figure 6. Typical Application Circuit for the MAX8672 Using a
2-Cell NiMH
for a PCB layout example.
Chip Information
PROCESS: BiCMOS
______________________________________________________________________________________
15
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