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参数资料
| 型号： | MAX8672ETD+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 7/17页 |
| 文件大小： | 0K |
| 描述： | IC MANAGE NIMH BACKUP 14-TDFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | 备份管理 |
| 电池化学： | 镍金属氢化物 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-WFDFN 裸露焊盘 |
| 供应商设备封装： | 14-TDFN-EP（3x3） |
| 包装： | 带卷 (TR) |
Complete Backup Management
IC for NiMH Batteries
Pin Description
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
—
NAME
CT
CHGI
TRKI
BATT
IN
DR
UV
GND
LX
BST
LDO
FBL
CHGV
THRM
EP
FUNCTION
Programming Input for Charge Timer. Connect a capacitor from CT to GND to program the charge timer
(range: 2min to 2000min, nominally programmed to 8h = 480min with C CT = 0.047μF).
Programming Input for the Standard Charge-Current Rate. Connect a resistor (R CHGI ) from CHGI to GND to
program the standard charge current from 100μA to 20mA.
Programming Input for the DC Trickle-Charge Rate. Connect a resistor from TRKI to GND to program the
trickle-charge current.
Backup-Battery Connection. The backup battery charges from IN but does not allow reverse current to IN
when V IN < V BATT . BATT input current is less than 0.1μA when V BATT is below the UV threshold.
Power Input. Range is 2.7V to 5.5V.
Programming Input for Deep-Recovery Threshold. The DR output adds charge current when V BATT is below the
V BATT(DR) threshold (and THRM is valid) by biasing an external resistor connected from DR to BATT. The DR
output voltage, V DR , is 0.816 times the V BATT(CHG) limit set by V CHGV (V DR = 1.224V for a 1.5V V BATT(CHG) ). The
DR current is sourced in addition to the standard charge current set by R CHGI .
Programming Input for the BATT Undervoltage Lockout (UVLO), V BATT(UV) . The UVLO threshold is
programmed by connecting a resistor from UV to GND. The backup LDO and boost converter cannot start
after UVLO occurs, or on power-up, until a valid V IN and V BST are applied. V BATT(UV) is programmable from
V BATT = 0.8V to 3.5V. An open circuit at UV disables the boost and LDO and interrupts battery drain. UVLO
also latches off backup circuitry to minimize battery drain.
Ground
Boost Converter Switch Node. Connect the boost inductor from LX to BATT.
Boost Converter Output. BST has reverse current blocking when V BST is higher than V IN or V BATT . The
MAX8672 operates with V BST down to 2.35V. The BST output is factory preset for 3.05V for use with 3.3V
systems. Other voltages are available on request.
LDO Output. Programmable from 1.5V to 3.05V. LDO has reverse current blocking.
Programming Input for the LDO Output Voltage. Connect FBL to the center of a resistor-divider connected
between LDO and GND. The FBL threshold is 1.25V.
Programming Input for the Charge Voltage Limit (V BATT(CHG) ). Also programs the trickle threshold
(V BATT(TRK) ), standard charge-restart voltage (V BATT(RSTRT) ), DR threshold (V BATT(DR) ), and the DR output
voltage (V DR ). For NiMH, program 1.5V V BATT(CHG) per cell, so that the max possible voltage is 1.55V per cell
with tolerances. V BATT(CHG) is programmable from 1.5V to 3.0V by connecting a resistor from CHGV to GND.
When the battery voltage rises to V BATT(CHG) , standard charging stops. When the battery voltage falls to
V BATT(TRK) , trickle charge begins. Standard charge does not resume until the battery voltage falls to
V BATT(RSTRT).
External Thermistor Monitor Connection. Connect an NTC (100k Ω at T A = +25°C) thermistor for -1°C and
+45°C charging cutoff. Only trickle charging is allowed outside the temperature limits. These temperature
thresholds are programmable by adding series and parallel resistors to the external thermistor. See Table 1.
Exposed Pad. Connect to GND but do not rely on EP for ground functions. This pad is internally connected to
ground through a soft connect, meaning there is no internal metal or bond wire physically connecting the
exposed pad to the GND pin. Connecting the exposed pad to ground does not remove the requirement for a
good ground connection to the appropriate pins. For good thermal dissipation, the exposed pad must be
soldered to the power ground plane.
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