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参数资料
| 型号： | MAX8922LETB+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 5/15页 |
| 文件大小： | 0K |
| 描述： | IC BATTERY CHARGER SGL 10TDFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | 充电管理 |
| 电池化学： | 锂离子（Li-Ion） |
| 电源电压： | 0 V ~ 28 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 供应商设备封装： | 10-TDFN EP（3x2） |
| 包装： | 带卷 (TR) |
30V Li+ Linear Battery Charger
with GSM Test Mode in 3mm x 2mm TDFN
Typical Operating Characteristics (continued)
(V IN = 5V, V EN /SET = 0V. V BAT = 4V, MAX8922L Evaluation Kit. T A = +25°C, unless otherwise noted.)
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
BAT REGULATION VOLTAGE ACCURACY
vs. AMBIENT TEMPERATURE
600
500
400
300
200
CHARGE CURRENT vs.
AMBIENT TEMPERATURE
1000
900
800
700
600
500
400
300
CHARGE CURRENT vs.
AMBIENT TEMPERATURE (1A CHARGE)
-0.6
-0.8
V IN = 5V
NO BATTERY
100
400mA PRESET
V IN = 5V
V BAT = 4V
200
100
R SETI = 1.5k I
V IN = 5V
V BAT = 4V
-1.0
0
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
-40
-15
10
35
60
85
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
Pin Description
PIN
1
2
3
4
5
6
7
8
9
10
—
NAME
IN
SETI
GND
LDO
MIN
EN /SET
TEST
CHG
POK
BAT
EP
FUNCTION
DC Input Supply. Connect IN to V IN > 4V and (V IN - V BAT ) ≥ 250mV up to a 7V charging source.
Bypass IN to GND with a 1μF or larger ceramic capacitor.
Charge-Current Program and Fast-Charge Current Monitor. Output current from SETI is 1000μA per
ampere of battery-charging current. Set the charging current by connecting a resistor (R SETI in Figure
1) from SETI to GND. I FAST-CHARGE = 1500V/R SETI . Connect to GND if pulse 1 mode (external SETI)
is not used.
Ground
4.94V Regulated LDO Output with Input Overvoltage Protection. Bypass LDO to GND with a 1μF or
larger ceramic capacitor. LDO can be used to supply low-voltage-rated USB systems.
Top-Off Current Threshold Programmable Input. I MIN = 150V/R MIN. Connect to GND if pulse 1 mode
(external SETI) is not used.
Active-Low Enable Input. EN /SET is used for programming fast-charge current and GSM test mode. For
detailed descriptions, see the Charger-Enable and Program Input ( EN /SET) section.
Factory Test Input. Connect to GND.
Charging-Status Output. CHG is internally pulled low when the charger is in prequalification or fast-
charge mode. CHG is high impedance when the charger is in top-off or disabled.
Input Power-OK Monitor. POK is an open-drain output that is internally pulled low when V IN is greater
than V UVLO and lower than V OVP and V IN > V BAT + 250mV. POK is high impedance when V IN is less
than V UVLO or greater than V OVP or V IN < V BAT + 100mV.
Battery Connection. The IC delivers charging current and monitors battery voltage using BAT. Bypass
BAT to GND with a 2.2μF or larger ceramic capacitor. BAT is high impedance when the IC is disabled.
Exposed Pad. Connect to the GND plane for increased thermal dissipation.
_______________________________________________________________________________________
5
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