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参数资料
| 型号： | MAX9726AETP+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 13/24页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO .124W STER 20TQFN |
| 标准包装： | 2,500 |
| 系列： | DirectDrive® |
| 类型： | AB 类 |
| 输出类型： | 耳机，2-通道（立体声） |
| 在某负载时最大输出功率 x 通道数量： | 124mW x 2 @ 16 欧姆 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 特点： | 低音增强模式，消除爆音，I²C，静音，短路和热保护，关机，音量控制 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 20-TQFN-EP（4x4） |
| 封装/外壳： | 20-WFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
MAX9726
Summing Amplifier (Audio Mixer)
Figure 10 shows the MAX9726 configured as a sum-
ming amplifier, which allows multiple audio sources to
be linearly mixed together. Using this configuration, the
output of the MAX9726 is equal to the weighted sum of
the input signals:
As shown in the above equation, the weighting or
amount of gain applied to each input signal source is
determined by the ratio of RF and the respective input
resistor (RIN1, RIN2, RIN3) connected to each signal
source. When BassMax is enabled, the low-frequency
gain (ABOOST) set by R1, R2, and C3 (see the Gain-
Setting Components section) adds to the gain deter-
mined by RF and RIN_. Select RF and RIN_ such that the
dynamic range of the MAX9726 is not exceeded when
BassMax is enabled and/or when the input signals are
at their maximum values and in phase with each other.
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Connect PGND and SGND together at a
single point (star ground point) on the PC board.
Connect PVSS to SVSS at the device and bypass this
connection with a 1F capacitor to PGND. Bypass VDD,
PREG, and NREG to PGND with a 1F capacitor. Place
the power-supply bypass capacitor and the charge-
pump hold capacitor as close as possible to the
MAX9726. Route PGND, and all traces that carry
switching transients, away from SGND and the audio
signal path. Route digital signal traces away from the
audio signal path. Make traces perpendicular to each
other when routing digital signals over or under audio
signals.
The TQFN package features an exposed pad that
improves thermal efficiency.
Ensure that the exposed
pad is electrically isolated from PGND, SGND, and
VDD. Connect the exposed pad to PVSS when the
board layout dictates that the exposed pad cannot
be left unconnected.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech-
niques, bump-pad layout, and recommended reflow
temperature profile, as well as the latest information on
reliability testing results, go to Maxim’s website at
www.maxim-ic.com/ucsp and look up the Application
Note:
UCSP—A Wafer-Level Chip-Scale Package.
VV
R
V
R
V
R
OUT
IN
F
IN
F
IN
F
IN
_ =+
+
1
2
3
DirectDrive, Headphone Amplifier with
BassMax, I2C, Volume and Gain Control
20
______________________________________________________________________________________
DIAGRAM SHOWN WITH BassMax DISABLED.
RF
RIN2
FB_
IN_
TO
ATTENUATOR
STAGE
VFB_ =
+
VIN1
RF
-(
)
RIN1
MAX9726
+
VIN2
RF
RIN2
VIN3
RF
RIN3
CIN
VIN2
RIN1
CIN
VIN1
RIN3
CIN
VIN3
Figure 10. Summing Amplifier
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX9726BEBP+ | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX9726BEBP+T | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX9726BETP+ | 功能描述:音频放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9726BETP+T | 功能描述:音频放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9726EVKIT+ | 功能描述:放大器 IC 开发工具 RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
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