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| 型号： | MAX9761EUI+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 14/31页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO PWR 3W STER 28TSSOP |
| 标准包装： | 2,500 |
| 类型： | AB 类 |
| 输出类型： | 2-通道（立体声）带立体声耳机 |
| 在某负载时最大输出功率 x 通道数量： | 3W x 2 @ 3 欧姆; 200mW x 2 @ 16 欧姆 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 特点： | 消除爆音，输入多路复用器，静音，关机，热保护， |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 28-TSSOP 裸露焊盘 |
| 封装/外壳： | 28-SOIC（0.173"，4.40mm 宽）裸露焊盘 |
| 包装： | 带卷 (TR) |
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MAX9760–MAX9763
Stereo 3W Audio Power Amplifiers with
Headphone Drive and Input Mux
______________________________________________________________________________________
21
depending on the status of the gain control input. The
stereo MAX9760/MAX9761 feature two gain options per
channel. The mono MAX9762/MAX9763 feature two
gain options per single-ended channel, and a single
gain option for the mono speaker amplifier (see Tables
1a and 1b for the gain-setting options).
The MAX9762 defaults to GAINM in speaker mode and
can switch between GAINA and GAINB in headphone
mode.
Bass Boost Circuit
Headphones typically have a poor low-frequency
response due to speaker and enclosure size limitations.
A bass boost circuit compensates the poor low-frequen-
cy response (Figure 9). At low frequencies, the capaci-
tor CF is an open circuit, and the effective impedance in
the feedback loop (RF(EFF)) is RF(EFF) = RF1.
At the frequency:
where the impedance, CF, begins to decrease, and at
high frequencies, the CF is a short circuit. Here the
impedance of the feedback loop is:
Assuming RF1 = RF2, then RF(EFF) at low frequencies is
twice that of RF(EFF) at high frequencies (Figure 10).
Thus, the amplifier has more gain at lower frequencies,
boosting the system’s bass response. Set the gain roll-
off frequency based upon the response of the speaker
and enclosure.
Layout and Grounding
Good PC board layout is essential for optimizing perfor-
mance. Use large traces for the power-supply inputs
and amplifier outputs to minimize losses due to para-
sitic trace resistance, as well as route heat away from
the device. Good grounding improves audio perfor-
mance, minimizes crosstalk between channels, and
prevents any digital switching noise from coupling into
the audio signal. If digital signal lines must cross over
or under audio signal lines, ensure that they cross per-
pendicular to each other.
The MAX9760–MAX9763 QFN and TSSOP-EP pack-
ages feature exposed thermal pads on their under-
sides. This pad lowers the package’s thermal
resistance by providing a direct heat conduction path
from the die to the printed circuit board. Connect the
pad to signal ground by using a large pad, or multiple
vias to the ground plane.
R
RR
F EFF
FF
() =
×
+
12
1
2
πRC
FF
VBIAS
RIN
RF2
RF1
CF
Figure 9. Bass Boost Circuit
RF1
RF1 RF2
RIN
2
π RF2 CF
1
FREQUENCY
GAIN
Figure 10. Bass Boost Response
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX9761EVKIT | 功能描述:放大器 IC 开发工具 RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
| MAX9762ETI | 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9762ETI+ | 功能描述:音频放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9762ETI+T | 功能描述:音频放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9762ETI-T | 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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