参数资料
型号: MAX9763ETI+T
厂商: Maxim Integrated Products
文件页数: 11/31页
文件大小: 0K
描述: IC AMP AUDIO PWR 3W MONO 28TQFN
标准包装: 2,500
类型: AB 类
输出类型: 1-通道(单声道),带立体声耳机
在某负载时最大输出功率 x 通道数量: 3W x 1 @ 3 欧姆; 200mW x 2 @ 16 欧姆
电源电压: 4.5 V ~ 5.5 V
特点: 消除爆音,输入多路复用器,静音,关机,热保护,
安装类型: 表面贴装
供应商设备封装: 28-TQFN-EP(5x5)
封装/外壳: 28-WFQFN 裸露焊盘
包装: 带卷 (TR)
MAX9760–MAX9763
Stereo 3W Audio Power Amplifiers with
Headphone Drive and Input Mux
______________________________________________________________________________________
19
When the MAX9760/MAX9762 are configured to auto-
matically detect the presence of a headphone jack, the
device defaults to gain setting A when the device is in
speaker mode. When the MAX9762/MAX9763 are con-
figured as speaker amplifiers, the gain setting defaults
to the mono setting (GAINM).
Single-Ended Headphone Amplifier
The MAX9760–MAX9763 can be configured as single-
ended headphone amplifiers through software or by
sensing the presence of a headphone plug (HPS). In
headphone mode, the inverting output of the BTL
amplifier is disabled, muting the speaker. The gain is
1/2 that of the device in speaker mode, and the output
power is reduced by a factor of 4.
In headphone mode, the load must be capacitively
coupled to the device, blocking the DC bias voltage
from the load (see Typical Application Circuit).
Power Dissipation and Heat Sinking
Under normal operating conditions, the MAX9760–
MAX9763 can dissipate a significant amount of power.
The maximum power dissipation for each package is
given in the Absolute Maximum Ratings section under
Continuous Power Dissipation or can be calculated by
the following equation:
where TJ(MAX) is +150°C, TA is the ambient tempera-
ture, and
θJA is the reciprocal of the derating factor in
°C/W as specified in the Absolute Maximum Ratings
section. For example,
θJA of the QFN package is
+42°C/W.
The increase in power delivered by the BTL configura-
tion directly results in an increase in internal power dis-
sipation over the single-ended configuration. The
maximum power dissipation for a given VDD and load is
given by the following equation:
If the power dissipation for a given application exceeds
the maximum allowed for a given package, either reduce
VDD, increase load impedance, decrease the ambient
temperature, or add heat sinking to the device. Large
output, supply, and ground PC board traces improve the
maximum power dissipation in the package.
Thermal overload protection limits total power dissipa-
tion in these devices. When the junction temperature
exceeds +160°C, the thermal protection circuitry dis-
ables the amplifier output stage. The amplifiers are
enabled once the junction temperature cools by 15°C.
This results in a pulsing output under continuous ther-
mal-overload conditions as the device heats and cools.
P
V
R
DISS MAX
DD
L
() =
2
π
P
TT
DISSPKG MAX
J MAX
A
JA
()
=
θ
REGISTER ADDRESS
0000 0000
BIT
NAME
VALUE
DESCRIPTION
0
Device temperature below thermal limit
7
THRM
1
Device temperature exceeding thermal limit
0
OUTR- current below current limit
6
AMPR-
1
OUTR- current exceeding current limit
0
OUTR+ current below current limit
5
AMPR+
1
OUTR+ current exceeding current limit
0
OUTL- current below current limit
4
AMPL-
1
OUTL- current exceeding current limit
0
OUTL+ current below current limit
3
AMPL+
1
OUTL+ current exceeding current limit
0
Device in speaker mode
2
HPSTS
1
Device in headphone mode
1
X
Don’t Care
0
X
Don’t Care
Table 6. Status Register Format
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