Stereo, High-Power, Class D Amplifiers
MAX98400A/MAX98400B
4
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PVDD to PGND......................................................-0.3V to +30V
VS to GND ...............................................................-0.3V to +6V
SHDN, MONO to GND ............................................-0.3V to +6V
IN_ to GND..............................................................-0.3V to +6V
G1, G2, RELEASE, TEMPLOCK,
LIM_TH to GND........................................ -0.3V to (VS + 0.3V)
OUT_ to PGND......................................-0.3V to (VPVDD + 0.3V)
PGND to GND ......................................................-0.3V to +0.3V
Continuous Current into OUT_ .......................................... +2.4A
Continuous Current into PVDD, PGND ............................. +4.8A
Continuous Current into All Other Pins ........................... +10mA
Duration of OUT_ Short Circuit to PVDD or PGND ...Continuous
Duration of Short Circuit Between
OUT_+ and OUT_-.................................................Continuous
Continuous Power Dissipation (TA = +70NC)
36-Pin TQFN Multilayer Board
(derate 35.7mW/NC above +70NC) .........................2857.1mW
B
JA (Note 1) .............................................................28NC/W
B
JC (Note 1)...............................................................1NC/W
24-Pin TQFN Multilayer Board
(derate 27.8mW/NC above +70NC) .............................35.7mW
B
JA (Note 1) .............................................................36NC/W
B
JC (Note 1)...............................................................3NC/W
Junction Temperature .....................................................+150NC
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL ChARACTERISTICS
(VPVDD = 18V, CIN = 1FF, VSHDN = 5V, LIM_TH = VS, TEMPLOCK = unconnected; G1 = GND, G2 = open (gain = 20.1dB), CREL
= 1FF, C1 = C2 = 1FF, RL = J, AC measurement bandwidth 20Hz to 20kHz, differential input signal, TA = TMIN to TMAX, unless
otherwise noted. Typical values are at TA = +25NC.) (Notes 2, 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
AMPLIFIER DC ChARACTERISTICS
PVDD Supply Voltage Range
VPVDD
Inferred from PVDD_PSRR
8
28
V
VS Supply Input Voltage
VS
Inferred from IVS test
4.75
5.5
V
Quiescent Current
IPVDD
Dual-supply mode:
VS = 4.75V, TA = +25NC
10
15
mA
IVS
6
8.2
Single-Supply
Quiescent Current
IPVDD
Single-supply mode:
TA = +25NC
16
23
mA
RL = 8I (Note 3)
17
Shutdown Current
ISHDN_PVDD
VSHDN = 0V, TA = +25NC,
VS = 5.5V
8
20
F
A
ISHDN_VS
3
10
PVDD Undervoltage Lockout
VUVLO
7
7.9
V
VS Regulator Output Voltage
VS
4.2
4.47
4.75
V
INPUT STAGE
Differential Input Voltage Range
2
VRMS
Single-Ended Input Voltage
Range
1
VRMS
Common-Mode Rejection Ratio
CMRR
60
dB
Input Resistance
Differential VLIM_TH = 0V, gain = +35dB
20
32
kI