参数资料
型号: MAXQ2000-RFX
厂商: MAXIM INTEGRATED PRODUCTS INC
元件分类: 微控制器/微处理器
英文描述: Low-Power LCD Microcontroller
中文描述: 16-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PQFP100
封装: 14 X 14 MM, 1.40 MM HEIGHT, LQFP-100
文件页数: 32/39页
文件大小: 484K
代理商: MAXQ2000-RFX
MAXQ2000
Low-Power LCD Microcontroller
38
____________________________________________________________________
Revision History
REVISION
NUMBER
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
0
10/04
Initial release for QFN package variant.
1
10/04
New product release for TQFN package variant.
1
In the Features section under Peripheral Features, corrected accumulator to
show 48 bits (not 40 bits).
1
In the Electrical Characteristics table, added Active Current line for 2.2V,
20MHz flash operation; VIH2(MIN) changed from 0.8 x VDDIO to 0.75 x VDDIO;
updated VIH, VIL, VOH, and VOL data to match GBD/FTEC data.
2, 3
2
12/04
Replaced the package drawing for 56-pin package.
38
Added lead-free part numbers to the Ordering Information table.
1
3
6/05
In the Electrical Characteristics table under LCD Segment Voltage, clarified
wording on VADJ spec to VADJ(MIN) = VADJ and VADJ(MAX) = 0.1V; changed
ISEGxx to 3μA.
3
4
10/05
Clarified that flash memory write/erase cycles and data retention specifications
are at +25°C.
4
Clarified VIH1/VIH3 specifications, matching presented values to test program
values (0.8 x VDDIO); clarified VIH2 specification, matching presented values to
test program values (0.8 x VLCD); clarified VIL2 specification, matching
presented values to test program values (0.2 x VDDIO). These changes do not
affect the testing or operation of the device.
2, 3
5
1/06
Corrected typo on pin 38 (Pin Configuration) from P4/
SS to P5.4/SS.
33
6
3/06
Corrected Pb-free package number denotations. Should be MAXQ2000-RAX+
and MAXQ2000-RBX+.
1, 30, 34
7
6/06
Added Revision A3 typ and max conditions to IDD6 in the Electrical
Characteristics table.
2
Added 100-pin LQFP package.
1, 7–11, 30, 35, 42
Added EP lines and note to QFN and TQFN pin configurations.
33, 34
Changed 4kWords Utility ROM (Memory Organization section) to 4kB.
13
Changed 4k x 16 Utility ROM (Figure 1) to 2k x 16 Utility ROM, changed 8FFFh
to 87FFh.
14
8
12/06
Changed 4kWord to 4kB (Utility ROM section).
15
Added VDD slew rate specification to Electrical Characteristics table.
2
Corrected references of
SSEL to SS.
5, 6
In the Typical Operating Circuit, added the reset monitor to ensure the VDD slew
rate specification is met.
36
9
3/08
Added QFN and TQFN package codes to the Ordering Information table;
removed package drawings and replaced with Package Information table.
37
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