参数资料
型号: MAXQ610A-0000+
厂商: Maxim Integrated Products
文件页数: 19/29页
文件大小: 0K
描述: IC MCU 16BIT 64K IR MOD 32TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 60
系列: MAXQ®
核心处理器: RISC
芯体尺寸: 16-位
速度: 12MHz
连通性: SPI,UART/USART
外围设备: 欠压检测/复位,红外线,电源故障,POR,WDT
输入/输出数: 20
程序存储器容量: 64KB(64K x 8)
程序存储器类型: 闪存
RAM 容量: 2K x 8
电压 - 电源 (Vcc/Vdd): 1.7 V ~ 3.6 V
振荡器型: 内部
工作温度: 0°C ~ 70°C
封装/外壳: 32-WFQFN 裸露焊盘
包装: 管件
其它名称: 90-M6800+B01
MAXQ610
16-Bit Microcontroller with Infrared Module
26
______________________________________________________________________________________
Applications Information
The low-power, high-performance RISC architecture of
this device makes it an excellent fit for many portable or
battery-powered applications. It is ideally suited for
applications such as universal remote controls that
require the cost-effective integration of IR transmit/
receive capability.
Grounds and Bypassing
Careful PCB layout significantly minimizes system-level
digital noise that could interact with the microcontroller
or peripheral components. The area under any digital
components should be a continuous ground plane if
possible. Keep any bypass capacitor leads short for
best noise rejection and place the capacitors as close
to the leads of the devices as possible.
CMOS design guidelines for any semiconductor require
that no pin be taken above VDD or below GND.
Violation of this guideline can result in a hard failure
(damage to the silicon inside the device) or a soft fail-
ure (unintentional modification of memory contents).
Voltage spikes above or below the device’s absolute
maximum ratings can potentially cause a devastating
IC latchup.
Microcontrollers commonly experience negative volt-
age spikes through either their power pins or general-
purpose I/O pins. Negative voltage spikes on power
pins are especially problematic as they directly couple
to the internal power buses. Devices such as keypads
can conduct electrostatic discharges directly into the
microcontroller and seriously damage the device.
System designers must protect components against
these transients that can corrupt system memory.
Differences for ROM Versions
The ROM-only versions of the MAXQ610 family devices
operate in the same manner as their flash counterparts
with the following exceptions:
The ROM loader is not available in the ROM version.
Loading memory and in-application programming
are not supported.
The debugger is not available in the ROM version.
Additional Documentation
Designers must have the following documents to fully
use all the features of this device. This data sheet con-
tains pin descriptions, feature overviews, and electrical
specifications. Errata sheets contain deviations from
published specifications. The user’s guides offer
detailed information about device features and opera-
tion. The following documents can be downloaded from
www.maxim-ic.com/microcontrollers.
This MAXQ610 data sheet, which contains electrical/
timing specifications and pin descriptions.
The MAXQ610 revision-specific errata sheet
(www.maxim-ic.com/errata).
The
MAXQ610 User's Guide, which contains detailed
information on core features and operation, including
programming.
STATE
POWER-FAIL
INTERNAL
REGULATOR
CRYSTAL
OSCILLATOR
SRAM
RETENTION
COMMENTS
D
Off
Yes
Application enters stop mode.
VDD > VRST.
CPU in stop mode.
E
On
(Periodically)
Off
Yes
VPOR < VDD < VRST.
An interrupt occurs that causes the CPU to exit
stop mode.
Power-fail monitor is turned on, detects a power-
fail, puts CPU in reset.
Power-fail monitor is turned on periodically.
F
Off
VDD < VPOR
Device held in reset. No operation allowed.
Table 6. Stop Mode Power-Fail Detection States with Power-Fail Monitor Disabled (continued)
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