参数资料
型号: MC26LS30DR2G
厂商: ON Semiconductor
文件页数: 5/14页
文件大小: 0K
描述: IC DRIVER LINE CONFIG 16SOIC
产品变化通告: Product Obsolescence 24/Jan/2011
标准包装: 1
类型: 驱动器
驱动器/接收器数: 4/0
规程: RS422,RS423
电源电压: 4.75 V ~ 5.25 V
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC
包装: 剪切带 (CT)
其它名称: MC26LS30DR2GOSCT
MC26LS30
http://onsemi.com
13
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16
9
SEATING
PLANE
F
J
M
R X 45
_
G
8 PL
P
B
A
M
0.25 (0.010)
B S
T
D
K
C
16 PL
S
B
M
0.25 (0.010)
A S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.80
10.00
0.386
0.393
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
5.80
6.20
0.229
0.244
R
0.25
0.50
0.010
0.019
____
SO16
D SUFFIX
CASE 751B05
ISSUE J
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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