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| 型号： | MC33186VW1 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 20/24页 |
| 文件大小： | 0K |
| 描述： | IC DRIVER H-BRIDGE 20-HSOP |
| 标准包装： | 1 |
| 类型： | 半桥 |
| 输入类型： | 非反相 |
| 输出数： | 2 |
| 导通状态电阻： | 150 毫欧 |
| 电流 - 输出 / 通道： | 5A |
| 电流 - 峰值输出： | 6.5A |
| 电源电压： | 5 V ~ 28 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.433"，11.00mm 宽）裸露焊盘 |
| 供应商设备封装： | 20-HSOP |
| 包装： | 管件 |
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
33186VW
20-PIN
HSOP-EP
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33186 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Package and Thermal Considerations
The MC33186 is offered in a 20 pin HSOP exposed pad, single die package.
There is a single heat source (P), a single junction temperature (T J ), and thermal
resistance (R ? JA ).
VW SUFFIX (Pb-FREE)
T J
=
R ? JA
.
P
98ASH70273A
20-PIN HSOP-EP
Note For package dimensions, refer to
the 33186 data sheet.
Standards
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Table 6. Thermal Performance Comparison
1.0
Thermal Resistance
[ ? C/W]
0.2
R ? JA
29
1.0
R ? JB (2) , (3)
R ? JA (1) , (4)
9.0
69
0.2
* All measurements ?
R ? JC (5) 2.0
Notes:
1. Per JEDEC JESD51-2 at natural convection, still air condition.
2. 2s2p thermal test board per JEDEC JESD51-5 and ?
JESD51-7.
3. Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4. Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
20 Pin HSOP-EP
1.6 mm Pitch
16.0 mm x 11.0 mm Body
12.3 mm x 7.1 mm Exposed Pad
are in millimeters
Soldermast ?
openings
Thermal vias ?
connected to top ?
buried plane
5. Thermal resistance between the die junction and the exposed
pad surface; cold plate attached to the package bottom side,
Figure 28. Thermal Land Pattern for Direct Thermal
Attachment According to JESD51-5
remaining surfaces insulated.
33186
Analog Integrated Circuit Device Data ?
20
Freescale Semiconductor
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC33186VW1/R2 | 制造商:Freescale Semiconductor 功能描述:MOSFET DRVR 7.8A 2-OUT Hi/Lo Side H Brdg Non-Inv 22-Pin(20+2Tab) HSOP T/R |
| MC33186VW1R2 | 功能描述:功率驱动器IC H-BRIDGE RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| MC33186VW2R2 | 功能描述:功率驱动器IC H-BRIDGE RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| MC33187 | 制造商:SPC Multicomp 功能描述:FUSE RESETTABLE SMD 0.14A 制造商:SPC Multicomp 功能描述:FUSE, PTC RESET, SMD, 60V, 140MA 制造商:SPC Multicomp 功能描述:RESETTABLE FUSE 90V 0.15A 制造商:SPC Multicomp 功能描述:FUSE, PTC RESET, 60V, 140mA, SMD; Holding Current:140mA; Tripping Current:300mA; Initial Resistance Max:6.5ohm; Operating Voltage:60V; PTC Fuse Case:SMD; MSL:MSL 2A - 4 weeks; External Depth:0.9mm; Initial Resistance Min:1.2ohm ;RoHS Compliant: Yes |
| MC33187 | 制造商:SPC Multicomp 功能描述:PTC Resettable Fuse |
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