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| 型号： | MC33689DDWB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 27/31页 |
| 文件大小： | 0K |
| 描述： | IC SYSTEM BASE W/LIN 32-SOIC |
| 标准包装： | 42 |
| 应用： | 自动镜像控制 |
| 接口： | SPI |
| 电源电压： | 5.5 V ~ 18 V |
| 封装/外壳： | 32-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 32-SOIC |
| 包装： | 管件 |
| 安装类型： | 表面贴装 |
| 配用： | KIT33689DWBEVB-ND - KIT FOR 33689 SBC WITH LIN |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33689
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VPWR Supply Voltage at VS1 and VS2
Continuous
Transient (Load Dump)
VSUPDC
VSUPTR
-0.3 to 27
40
V
Supply Voltage at VDD and VCC
VDD
-0.3 to 5.5
V
Output Current at VDD
IDD
Internally Limited
A
Logic Input Voltage at MOSI, SCLK, CS, IN, and TXD
VINLOG
-0.3 to VDD+0.3
V
Logic Output Voltage at MISO, INT, RST, and RXD
VOUTLOG
-0.3 to VDD+0.3
V
Input Voltage at E+ and E
-
VE+/VE-
-0.3 to 7.0
V
Input Current at E+ and E
-
IE+/IE-
±20
mA
Output Voltage at OUT
VOUT
-0.3 to VCC+0.33
V
Output Current at OUT
IOUT
±20
mA
Input Voltage at L1 and L2
DC Input with a 33 k
Ω Resistor
Transient Input with External Component (per ISO7637 Specification) (See
VLXDC
VLXTR
-18 to 40
±100
V
Input/Output Voltage at LIN
DC Voltage
Transient Input Voltage with specified External Component (per ISO7637
Specification) (See Figure 4, page 6)
VBUSDC
VBUSTR
-18 to 40
-150 to 100
V
DC Output Voltage at HS1 and HS2
Positive
Negative
VHS+
VHS-
VVS2 + 0.3
Internally Clamped
V
DC Output Voltage at HS3
VHS3
-0.3 to VVS2 + 0.3
V
ESD Voltage, Human Body Model (1)
GND Configured as Ground. TGND and AGND Configured as I/O Pins
LIN, L1, and L2
All Other Pins
VESD1
±4000
±2000
V
ESD Voltage, Charge Device Model (1)
Corner Pins (Pins 1, 16, 17, and 32)
All other Pins (Pins 2–15 and 18–31)
VESD2
±750
±500
V
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Charge Device Model, Robotic (CZAP =4.0 pF).
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC33689DDWBR2 | 功能描述:CAN 接口集成电路 SBCLIN RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
| MC33689DPEW | 制造商:Freescale Semiconductor 功能描述:SYSTEM BASIS CHIP W/LIN 制造商:Freescale Semiconductor 功能描述:SYSTEM BASIS CHIP W/LIN - Bulk 制造商:Freescale Semiconductor 功能描述:IC SYSTEM BASIS W/LIN 32SOIC |
| MC33689DPEWR2 | 制造商:Freescale Semiconductor 功能描述:SYSTEM BASIS CHIP W/LIN 制造商:Freescale Semiconductor 功能描述:SYSTEM BASIS CHIP W/LIN - Tape and Reel 制造商:Freescale Semiconductor 功能描述:IC SYSTEM BASIS W/LIN 32SOIC |
| MC33689DWB | 功能描述:CAN 接口集成电路 SBCLIN RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
| MC33689DWBR2 | 功能描述:CAN 接口集成电路 SBCLIN RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
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