参数资料
型号: MC33689DDWB
厂商: Freescale Semiconductor
文件页数: 7/31页
文件大小: 0K
描述: IC SYSTEM BASE W/LIN 32-SOIC
标准包装: 42
应用: 自动镜像控制
接口: SPI
电源电压: 5.5 V ~ 18 V
封装/外壳: 32-SOIC(0.295",7.50mm 宽)
供应商设备封装: 32-SOIC
包装: 管件
安装类型: 表面贴装
配用: KIT33689DWBEVB-ND - KIT FOR 33689 SBC WITH LIN
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
33689
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
LIN PHYSICAL LAYER: RECEIVER CHARACTERISTICS AND WAKE-UP TIMINGS
Propagation Delay LIN to RXD (24)
Dominant State (LIN LOW to RXD LOW)
Recessive State (LIN HIGH to RXD HIGH)
Symmetry (
tRDOM - tRREC)
tRDOM
tRREC
tRSYM
-2.0
3.0
6.0
2.0
μs
Bus Wake-Up Deglitcher (Sleep and Stop Modes) (25)
tPROPWL
30
70
90
μs
Bus Wake-Up Event Reported
From Sleep Mode (26)
From Stop Mode (27)
tWU
30
20
μs
Notes
24.
Measured between LIN signal threshold VINL or VINH and 50% of RXD signal.
25.
26.
tWU is typically 2 internal clock cycles after a LIN rising edge is detected. In Sleep Mode, the measurement is done without a capacitor
connected to the regulator. The delay is measured between the VSUP/2 rising edge of the LIN bus and when VDD reaches 3.0 V. The
VDD rise time is strongly dependent upon the decoupling capacitor at VDD pin. See Figure 9, page 18.
27.
tWU is typically 2 internal clock cycles after a LIN rising edge is detected. In Stop Mode, the delay is measured between the VSUP/2
rising edge of the LIN bus and the falling edge of the INT pin. See Figure 10, page 18.
Table 4. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V
≤ V
SUP ≤ 18 V, - 40°C ≤ T
A ≤ 125°C, GND = 0.0 V unless otherwise noted.
Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
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