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参数资料
| 型号： | MC33926PNBR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 6/25页 |
| 文件大小： | 0K |
| 描述： | IC H-BRIDGE THROTTLE CTRL 32-QFN |
| 标准包装： | 1 |
| 类型： | 半桥 |
| 输入类型： | 非反相 |
| 输出数： | 2 |
| 导通状态电阻： | 120 毫欧 |
| 电流 - 峰值输出： | 5A |
| 电源电压： | 5 V ~ 28 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-PowerQFN |
| 供应商设备封装： | 32-PQFN（8x8） |
| 包装： | 标准包装 |
| 其它名称： | MC33926PNBR2DKR |
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device. These parameters are not production tested.
Ratings
Peak Package Reflow Temperature During Reflow (7) , (8)
Approximate Junction-to-Case Thermal Resistance (9)
Symbol
T PPRT
R θ JC
Value
250
< 1.0
Unit
°C
° C/W
Notes
7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C for Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
9. Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R θ JB (junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness and area. Maximum current at maximum
die temperature represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R θ JA must be
< 5.0 ° C/W for maximum current at 70 ° C ambient. Module thermal design must be planned accordingly.
33926
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
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