参数资料
型号: MC56F8006VLC
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP32
封装: 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
文件页数: 47/106页
文件大小: 1215K
代理商: MC56F8006VLC
Specifications
MC56F8006/MC56F8002 Digital Signal Controller, Rev. 4
Freescale Semiconductor
45
NOTE
Junction-to-ambient thermal resistance determined per JEDEC JESD51–3 and JESD51–6.
Thermal test board meets JEDEC specification for this package.
Junction-to-board thermal resistance determined per JEDEC JESD51–8. Thermal test
board meets JEDEC specification for the specified package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1.
The cold plate temperature is used for the case temperature. Reported value includes the
thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the
package top and the junction temperature per JEDEC JESD51–2. When Greek letters are
not available, the thermal characterization parameter is written as Psi-JT
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power
dissipation of other components on the board, and board thermal resistance.
See Section 9.1, “Thermal Design Considerations,” for more detail on thermal design
considerations.
8.4
Recommended Operating Conditions
This section includes information about recommended operating conditions.
Table 18. 48LQFP Package Thermal Characteristics
Characteristic
Comments
Symbol
Value
(LQFP)
Unit
Junction to ambient
Natural convection
Single layer board
(1s)
RJA
79
°C/W
Junction to ambient
Natural convection
Four layer board
(2s2p)
RJMA
55
°C/W
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
RJMA
66
°C/W
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
RJMA
48
°C/W
Junction to board
RJB
34
°C/W
Junction to case
RJC
20
°C/W
Junction to package top
Natural Convection
JT
4°C/W
相关PDF资料
PDF描述
MC56F8006VLF 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP48
MC56F8006MWL 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PDSO28
MC56F8006MLF 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP48
MC56F8323MFB60 0-BIT, 120 MHz, OTHER DSP, PQFP64
MC68020CFC25E 32-BIT, 25 MHz, MICROPROCESSOR, PQFP132
相关代理商/技术参数
参数描述
MC56F8006VLF 功能描述:数字信号处理器和控制器 - DSP, DSC DSC 48LQFP 16K Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MC56F8006VLF 制造商:Freescale Semiconductor 功能描述:IC DSC 16BIT 16KB 32MHZ 3.6V LQFP-48
MC56F8006VWL 功能描述:数字信号处理器和控制器 - DSP, DSC 16 BIT DSPHC RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MC56F8006VWL 制造商:Freescale Semiconductor 功能描述:IC DSC 16BIT 16KB 32MHZ 3.6V SOIC-28
MC56F8006VWLR 功能描述:数字信号处理器和控制器 - DSP, DSC 16 BIT DSPHC RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT