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参数资料
| 型号： | MC56F8006VLC |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP32 |
| 封装： | 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32 |
| 文件页数： | 73/106页 |
| 文件大小： | 1215K |
| 代理商： | MC56F8006VLC |
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Specifications
MC56F8006/MC56F8002 Digital Signal Controller, Rev. 4
Freescale Semiconductor
69
Power consumption is given by the following equation:
Eqn. 1
A, the internal [static] component, is comprised of the DC bias currents for the oscillator, leakage currents, PLL, and voltage
references. These sources operate independently of processor state or operating frequency.
B, the internal [state-dependent] component, reflects the supply current required by certain on-chip resources only when those
resources are in use. These include RAM, flash memory, and the ADCs.
C, the internal [dynamic] component, is classic C*V2*F CMOS power dissipation corresponding to the 56800E core and
standard cell logic.
D, the external [dynamic] component, reflects power dissipated on-chip as a result of capacitive loading on the external pins of
the chip. This is also commonly described as C*V2*F, although simulations on two of the I/O cell types used on the 56800E
reveal that the power-versus-load curve does have a non-zero Y-intercept.
Power due to capacitive loading on output pins is (first order) a function of the capacitive load and frequency at which the
outputs change. Table 39 provides coefficients for calculating power dissipated in the I/O cells as a function of capacitive load.
In these cases:
TotalPower =
((Intercept + Slope*Cload)*frequency/10 MHz)
Eqn. 2
where:
Summation is performed over all output pins with capacitive loads
Total power is expressed in mW
Cload is expressed in pF
Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found to be fairly low when
averaged over a period of time.
E, the external [static component], reflects the effects of placing resistive loads on the outputs of the device. Sum the total of
all V2/R or IV to arrive at the resistive load contribution to power. Assume V = 0.5 for the purposes of these rough calculations.
For instance, if there is a total of eight PWM outputs driving 10 mA into LEDs, then P = 8*0.5*0.01 = 40 mW.
In previous discussions, power consumption due to parasitics associated with pure input pins is ignored, as it is assumed to be
negligible.
Total power =
A:
internal [static component]
+B: internal [state-dependent component]
+C:
internal [dynamic component]
+D:
external [dynamic component]
+E:
external [static component]
Table 39. I/O Loading Coefficients at 10 MHz
Intercept
Slope
8 mA drive
1.3
0.11 mW/pF
4 mA drive
1.15 mW
0.11 mW/pF
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相关代理商/技术参数 |
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| MC56F8006VLF | 功能描述:数字信号处理器和控制器 - DSP, DSC DSC 48LQFP 16K Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
| MC56F8006VLF | 制造商:Freescale Semiconductor 功能描述:IC DSC 16BIT 16KB 32MHZ 3.6V LQFP-48 |
| MC56F8006VWL | 功能描述:数字信号处理器和控制器 - DSP, DSC 16 BIT DSPHC RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
| MC56F8006VWL | 制造商:Freescale Semiconductor 功能描述:IC DSC 16BIT 16KB 32MHZ 3.6V SOIC-28 |
| MC56F8006VWLR | 功能描述:数字信号处理器和控制器 - DSP, DSC 16 BIT DSPHC RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
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