参数资料
型号: MC8640DTHX1000HE
厂商: Freescale Semiconductor
文件页数: 26/130页
文件大小: 0K
描述: IC DUAL CORE PROCESSOR 1023-CBGA
标准包装: 1
系列: MPC86xx
处理器类型: 32-位 MPC86xx PowerPC
速度: 1.0GHz
电压: 1.05V
安装类型: 表面贴装
封装/外壳: 1023-BCBGA,FCCBGA
供应商设备封装: 1023-FCCBGA(33x33)
包装: 托盘
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
121
System Design Information
SENSEVSS_Core1 and needs to be connected to ground with a weak (2–10 kΩ) pull down resistor.
Likewise, AVDD_Core1 needs to be pulled to ground as shown in Figure 64.
The mechanical drawing for the single core device is located in Section 16.2, “Mechanical Dimensions of
For other pin pull-up or pull-down recommendations of signals, please see Section 17, “Signal Listings.”
20.7
Output Buffer DC Impedance
The MPC8640 drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 66). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN) ÷ 2.
Figure 66. Driver Impedance Measurement
Table 73 summarizes the signal impedance targets. The driver impedances are targeted at minimum VDD,
nominal OVDD, 105 °C.
Table 73. Impedance Characteristics
Impedance
DUART, Control,
Configuration, Power
Management
PCI
Express
DDR DRAM
Symbol
Unit
RN
43 Target
25 Target
20 Target
Z0
W
RP
43 Target
25 Target
20 Target
Z0
W
Note: Nominal supply voltages. See Table 1, Tj = 105 °C.
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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