参数资料
型号: MC8641HX1333NC
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: MICROPROCESSOR, CBGA1023
封装: 33 X 33 MM, CERAMIC, BGA-1023
文件页数: 20/140页
文件大小: 1484K
代理商: MC8641HX1333NC
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
116
Freescale Semiconductor
Thermal
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
19.2.1
Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 71, the intrinsic conduction thermal
resistance paths are as follows:
The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
The die junction-to-board thermal resistance
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