参数资料
型号: MC8641HX1333NC
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: MICROPROCESSOR, CBGA1023
封装: 33 X 33 MM, CERAMIC, BGA-1023
文件页数: 22/140页
文件大小: 1484K
代理商: MC8641HX1333NC
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
118
Freescale Semiconductor
Thermal
Figure 61. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Corporate Center
PO Box 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
0
0.5
1
1.5
2
0
1020
30
40
50607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Speci
fi
c
The
rm
a
lR
e
si
st
a
n
ce
(K-
in.
2
/W
)
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