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参数资料
| 型号： | MC9328MX1DVM20R2 |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 200 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, MAPBGA-256 |
| 文件页数： | 5/94页 |
| 文件大小： | 1487K |
| 代理商： | MC9328MX1DVM20R2 |
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Specifications
MOTOROLA
MC9328MX1 Advance Information
13
3 Specifications
This section contains the electrical specifications and timing diagrams for the MC9328MX1 processor.
3.1 Maximum Ratings
Table 4 provides information on maximum ratings.
3.2 Recommended Operating Range
Table 5 provides the recommended operating ranges for the supply voltages. The MC9328MX1 processor
has multiple pairs of VDD and VSS power supply and return pins. QVDD and QVSS pins are used for
internal logic. All other VDD and VSS pins are for the I/O pads voltage supply, and each pair of VDD and
VSS provides power to the enclosed I/O pads. This design allows different peripheral supply voltage levels
in a system.
Because AVDD pins are supply voltages to the analog pads, it is recommended to isolate and noise-filter
the AVDD pins from other VDD pins.
BTRFVDD is the supply voltage for the Bluetooth interface signals. It is quite sensitive to the data
transmit/receive accuracy. Please refer to Bluetooth RF spec for special handling. If Bluetooth is not used
in the system, these Bluetooth pins can be used as general purpose I/O pins and BTRFVDD can be used as
other NVDD pins.
Table 4. Maximum Ratings
Rating
Symbol
Minimum
Maximum
Unit
Supply voltage
Vdd
-0.3
3.3
V
Maximum operating temperature range
MC9328MX1VH20/MC9328MX1VM20
TA
070
°C
Maximum operating temperature range
MC9328MX1DVH20/MC9328MX1DVM20
TA
-30
70
°C
Maximum operating temperature range
MC9328MX1CVH15/MC9328MX1CVM15
TA
-40
85
°C
ESD at human body model (HBM)
VESD_HBM
–
2000
V
ESD at machine model (MM)
VESD_MM
–
100
V
Latch-up current
ILatchup
–
200
mA
Storage temperature
Test
-55
150
°C
Power Consumption
Pmax
8001
1.
A typical application with 30 pads simultaneously switching assumes the GPIO toggling and instruction
fetches from the ARM core-that is, 7x GPIO, 15x Data bus, and 8x Address bus.
13002
2.
A worst-case application with 70 pads simultaneously switching assumes the GPIO toggling and
instruction fetches from the ARM core-that is, 32x GPIO, 30x Data bus, 8x Address bus. These
calculations are based on the core running its heaviest OS application at 200MHz, and where the whole
image is running out of SDRAM. QVDD at 2.0V, NVDD and AVDD at 3.3V, therefore, 180mA is the worst
measurement recorded in the factory environment, max 5mA is consumed for OSC pads, with each toggle
GPIO consuming 4mA.
mW
相关PDF资料 |
PDF描述 |
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| MC9328MX21DVMR2 | 32-BIT, 266 MHz, MICROPROCESSOR, PBGA289 |
| MC9328MX21DVM | 32-BIT, 266 MHz, MICROPROCESSOR, PBGA289 |
| MC9328MX21DVKR2 | 32-BIT, 266 MHz, MICROPROCESSOR, PBGA289 |
| MC9328MX21VK | 32-BIT, 266 MHz, MICROPROCESSOR, PBGA289 |
| MC9328MX21DVK | 32-BIT, 266 MHz, MICROPROCESSOR, PBGA289 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MC9328MX1P/D | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:i.MX Integrated Portable System Processor |
| MC9328MX1S | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:i.MX Integrated Portable System Processor |
| MC9328MX1SRM/D | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:i.MX Integrated Portable System Processor |
| MC9328MX1VH20 | 功能描述:IC MCU I.MX 200MHZ 256-MAPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:i.MX1 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN，SCI，SPI 外围设备:POR，PWM，温度传感器，WDT 输入/输出数:21 程序存储器容量:40KB（20K x 16） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| MC9328MX1VM15 | 功能描述:IC MCU I.MX 150MHZ 256-MAPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:i.MX1 标准包装:1 系列:87C 核心处理器:MCS 51 芯体尺寸:8-位 速度:16MHz 连通性:SIO 外围设备:- 输入/输出数:32 程序存储器容量:8KB（8K x 8） 程序存储器类型:OTP EEPROM 大小:- RAM 容量:256 x 8 电压 - 电源 (Vcc/Vdd):4 V ~ 6 V 数据转换器:- 振荡器型:外部 工作温度:0°C ~ 70°C 封装/外壳:44-DIP 包装:管件 其它名称:864285 |
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