参数资料
型号: MC9S12C32CPB
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP52
封装: LQFP-52
文件页数: 51/94页
文件大小: 906K
代理商: MC9S12C32CPB
Device User Guide — 9S12C32DGV1/D V01.01
55
NOTE:
Instead of specifying ambient temperature all parameters are specified for the more
meaningful silicon junction temperature. For power dissipation calculations refer
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (TJ)in °C can be
obtained from:
The total power dissipation can be calculated from:
Two cases with internal voltage regulator enabled and disabled must be considered:
Table A-4 Operating Conditions
Rating
Symbol
Min
Typ
Max
Unit
I/O, Regulator and Analog Supply Voltage
VDD5
3.15
5
5.5
V
Digital Logic Supply Voltage1
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when this regulator is disabled and the device is powered from an external
source.
VDD
2.25
2.5
2.75
V
PLL Supply Voltage (1)
VDDPLL
2.25
2.5
2.75
V
Voltage Difference VDDX to VDDA
VDDX
-0.1
0
0.1
V
Voltage Difference VSSX to VSSR and VSSA
VSSX
-0.1
0
0.1
V
Oscillator
fosc
0.5
-
16
MHz
Bus Frequency
fbus
0.5
-
25
MHz
Operating Junction Temperature Range
T
J
-40
-
140
°C
T
J
T
A
P
D
Θ
JA
()
+
=
T
J
Junction Temperature, [
°C ]
=
T
A
Ambient Temperature, [
°C ]
=
P
D
Total Chip Power Dissipation, [W]
=
Θ
JA
Package Thermal Resistance, [
°C/W]
=
P
D
P
INT
P
IO
+
=
P
INT
Chip Internal Power Dissipation, [W]
=
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