参数资料
型号: MCF51MM128CMB
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, FLASH, 50.33 MHz, MICROCONTROLLER, PBGA81
封装: 10 X 10 MM, ROHS COMPLIANT, MAPBGA-81
文件页数: 9/58页
文件大小: 609K
代理商: MCF51MM128CMB
Electrical Characteristics
Freescale Semiconductor
17
3.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or
VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD JA)
Eqn. 1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
Table 6. Thermal Characteristics
#
Symbol
Rating
Value
Unit
1TA
Operating temperature range (packaged):
C
MCF51MM256
–40 to 105
MCF51MM128
–40 to 105
2TJMAX
Maximum junction temperature
135
C
3
JA
Thermal resistance1,2,3,4 Single-layer board — 1s
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2
Junction to Ambient Natural Convection
3
1s — Single layer board, one signal layer
4
2s2p — Four layer board, 2 signal and 2 power layers
C/W
104-pin MBGA
67
100-pin LQFP
53
81-pin MBGA
67
80-pin LQFP
53
4
JA
Thermal resistance1, 2, 3, 4 Four-layer board — 2s2p
C/W
104-pin MBGA
39
100-pin LQFP
41
81-pin MBGA
39
80-pin LQFP
39
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
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