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| 型号： | MCF52210CVM66J |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 24/56页 |
| 文件大小： | 0K |
| 描述： | IC MCU RISC 64K FLASH 81MAPBGA |
| 标准包装： | 1,200 |
| 系列： | MCF5221x |
| 核心处理器： | Coldfire V2 |
| 芯体尺寸： | 32-位 |
| 速度： | 66MHz |
| 连通性： | I²C，SPI，UART/USART，USB OTG |
| 外围设备： | DMA，LVD，POR，PWM，WDT |
| 输入/输出数： | 55 |
| 程序存储器容量： | 64KB（64K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 16K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 3 V ~ 3.6 V |
| 数据转换器： | A/D 8x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 81-LBGA |
| 包装： | 托盘 |
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Electrical Characteristics
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
30
2.4
Flash Memory Characteristics
1
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
4 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
The average chip-junction temperature (TJ) in C can be obtained from:
(1)
Where:
TA
= ambient temperature,
C
JA
= package thermal resistance, junction-to-ambient,
C/W
PD
= PINT PI/O
PINT
= chip internal power, IDD VDD, watts
PI/O
= power dissipation on input and output pins — user determined, watts
For most applications PI/O PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
(2)
Solving equations 1 and 2 for K gives:
K = PD (TA + 273 C) + JMA PD
2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for
any value of TA.
Table 23. SGFM Flash Program and Erase Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
Symbol
Min
Typ
Max
Unit
System clock (read only)
fsys(R)
0—
50–801
1
Depending on packaging; see the orderable part number summary.
MHz
System clock (program/erase)2
2 Refer to the flash memory section for more information
fsys(P/E)
0.15
—
102.4
MHz
TJ
TA
PD JMA
+
=
PD
KTJ 273C
+
=
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF52210CVM80 | 功能描述:32位微控制器 - MCU KIRIN0 WITH USB 64K FLSH RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF52211 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire Microcontroller |
| MCF52211_07 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire Microcontroller |
| MCF52211CAE66 | 功能描述:32位微控制器 - MCU KIRIN0 WITH USB RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF52211CAE80 | 功能描述:32位微控制器 - MCU KIRIN0 WITH USB RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
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