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参数资料
| 型号： | MCF52256CAG66 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PQFP144 |
| 封装： | 20 X 20 MM, ROHS COMPLIANT, LQFP-144 |
| 文件页数： | 20/46页 |
| 文件大小： | 560K |
| 代理商： | MCF52256CAG66 |
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MCF52259 ColdFire Microcontroller, Rev. 4
Electrical Characteristics
Freescale Semiconductor
27
100 LQFP
Junction to ambient, natural convection
Single layer board (1s)
JA
5313,14
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
391,15
C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
JMA
421,3
C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
JMA
331,3
C/W
Junction to board
—
JB
2516
C/W
Junction to case
—
JC
917
C/W
Junction to top of package
Natural convection
jt
218
C/W
Maximum operating junction temperature
—
Tj
105
oC
1
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
4 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
7
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
8 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
9 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
10 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
11 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
12 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
13
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
14 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
15 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Table 8. Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF52256CAG66 | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MCU COLDFIRE/68K 66MHZ LQFP-144 |
| MCF52256CVN66 | 功能描述:32位微控制器 - MCU KIRN3 144MAPBGA RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF52256CVN66 | 制造商:Freescale Semiconductor 功能描述:32-bit Microcontroller IC |
| MCF52256CVN66J | 制造商:Freescale Semiconductor 功能描述:32-BIT MCF5225X COLDFIRE RISC 256KB FLASH 3.3V 144-PIN MA-B - Bulk |
| MCF52256VN80 | 制造商:Freescale Semiconductor 功能描述:MCU 32BIT V2 RISC 256KB FLASH 3.3V 144MAPBGA - Trays 制造商:Freescale Semiconductor 功能描述:MCU 32BIT COLDFIRE V2 144MAPBGA 制造商:Freescale Semiconductor 功能描述:32-bit Microcontroller IC 制造商:Freescale Semiconductor 功能描述:MCF5225X Series 32 Bit 80 Mhz Microcontroller - MAPBGA-144 |
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