参数资料
型号: MCF52277CVM160J
厂商: Freescale Semiconductor
文件页数: 9/46页
文件大小: 0K
描述: IC MCU V2 32BIT 196MAPBGA
标准包装: 126
系列: MCF5227x
核心处理器: Coldfire V2
芯体尺寸: 32-位
速度: 166.67MHz
连通性: CAN,EBI/EMI,I²C,SPI,SSI,UART/USART,USB OTG
外围设备: DMA,LCD,PWM,WDT
输入/输出数: 55
程序存储器类型: ROMless
RAM 容量: 128K x 8
电压 - 电源 (Vcc/Vdd): 1.4 V ~ 1.6 V
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 196-LBGA
包装: 托盘
Electrical Characteristics
MCF5227x ColdFire Microprocessor Data Sheet, Rev. 8
Freescale Semiconductor
17
5.2
Thermal Characteristics
The average chip-junction temperature (TJ) in °C can be obtained from:
Eqn. 1
Where:
TA
= Ambient Temperature,
°C
QJMA
= Package Thermal Resistance, Junction-to-Ambient,
°C/W
PD
=PINT + PI/O
PINT
=IDD × IVDD, Watts - Chip Internal Power
PI/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
Table 8. Thermal Characteristics
Characteristic
Symbol
196
MAPBGA
176
LQFP
Unit
Junction to ambient, natural convection
Four layer board (2s2p)
θ
JA
381,2
1
θ
JA, θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
Freescale recommends the use of
θ
JmA and power dissipation specifications in the system design to prevent device
junction temperatures from exceeding the rated specification. System designers should be aware that device
junction temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the
device junction temperature specification can be verified by physical measurement in the customer’s system using
the
Ψ
jt parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-6 with the board horizontal.
°C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
θ
JMA
341,2
°C/W
Junction to board
θ
JB
273
3 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
373
°C/W
Junction to case
θ
JC
174
4 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
144
°C/W
Junction to top of package
Ψ
jt
41,5
5 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written in conformance with Psi-JT.
°C/W
Maximum operating junction temperature
Tj
105
oC
T
J
T
A
P
D
Θ
JMA
×
()
+
=
P
D
K
T
J
273
°C
+
()
---------------------------------
=
KP
D
T
A
273
°C
×
() Q
JMA
P
D
2
×
+
×
=
相关PDF资料
PDF描述
MCF5251CVM140 IC MPU 32BIT 140MHZ 225-MAPBGA
MCF5253CVM140J IC MCU 2.1MIPS 140MHZ 225MAPBGA
MCF5270CVM150 IC MCU 32BIT 150MHZ 196-MAPBGA
MCF5272VF66J IC MCU 32BIT 66MHZ 196-MAPBGA
MCF5275CVM166 IC MCU 32BIT 166MHZ 256-MAPBGA
相关代理商/技术参数
参数描述
MCF5232 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Microprocessor Hardware Specification
MCF5232160QFP 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Microprocessor Hardware Specification
MCF5232196MAPBGA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Microprocessor Hardware Specification
MCF5232CAB80 功能描述:微处理器 - MPU MCF5232 V2CORE 64KSRAM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MCF5232CVM100 功能描述:微处理器 - MPU MCF5232 V2CORE 64KSRAM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324