参数资料
型号: MCF5275LCVM133
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 133 MHz, RISC PROCESSOR, PBGA196
封装: MAPBGA-196
文件页数: 11/44页
文件大小: 1242K
代理商: MCF5275LCVM133
Preliminary Electrical Characteristics
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 2
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
19
8.2
Thermal Characteristics
Table 8 lists thermal resistance values
Instantaneous Maximum Current
Single pin limit (applies to all pins) 4, 5
ID
25
mA
Operating Temperature Range (Packaged)
TA
(TL - TH)
– 40 to 85
°C
Storage Temperature Range
Tstg
– 65 to 150
°C
1
Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum Ratings
are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond those
listed may affect device reliability or cause permanent damage to the device.
2
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either VSS or O VDD).
3
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use
the larger of the two values.
4
All functional non-supply pins are internally clamped to VSS and O VDD.
5
Power supply must maintain regulation within operating O VDD range during instantaneous and
operating maximum current conditions. If positive injection current (Vin > O VDD) is greater than IDD, the
injection current may flow out of O VDD and could result in external power supply going out of
regulation. Insure external O VDD load will shunt current greater than maximum injection current. This
will be the greatest risk when the MCU is not consuming power (ex; no clock).Power supply must
maintain regulation within operating VDD range during instantaneous and operating maximum current
conditions.
Table 8. Thermal characteristics
Characteristic
Symbol
256MBGA
196MBGA
Unit
Junction to ambient, natural convection
Four layer board (2s2p)
θ
JMA
261,2
1
θ
JMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
Ψ
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-6 with the board horizontal.
°C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
θ
JMA
231,2
°C/W
Junction to board
θ
JB
153
3
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
203
°C/W
Junction to case
θ
JC
104
4
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
104
°C/W
Junction to top of package
Natural convection
Ψ
jt
°C/W
Maximum operating junction temperature
Tj
105
oC
Table 7. Absolute Maximum Ratings1, 2 (continued)
Rating
Symbol
Value
Unit
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