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参数资料
| 型号： | MCF5327CVM240 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 240 MHz, RISC PROCESSOR, PBGA196 |
| 封装： | 15 X 15 MM, ROHS COMPLIANT, MAPBGA-196 |
| 文件页数： | 9/50页 |
| 文件大小： | 1114K |
| 代理商： | MCF5327CVM240 |
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Electrical Characteristics
MCF532x ColdFire Microprocessor Data Sheet, Rev. 5
Freescale Semiconductor
17
5.2
Thermal Characteristics
The average chip-junction temperature (TJ) in °C can be obtained from:
Eqn. 1
Where:
TA
= Ambient Temperature,
°C
QJMA
= Package Thermal Resistance, Junction-to-Ambient,
°C/W
PD
=PINT + PI/O
PINT
=IDD × IVDD, Watts - Chip Internal Power
PI/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
Table 5. Thermal Characteristics
Characteristic
Symbol
256MBGA
196MBGA
Unit
Junction to ambient, natural convection
Four layer board
(2s2p)
θ
JMA
371,2
1
θ
JMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
Freescale recommends the use of
θ
JmA and power dissipation specifications in the system design to prevent
device junction temperatures from exceeding the rated specification. System designers should be aware that
device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in the
customer’s system using the
Ψ
jt parameter, the device power dissipation, and the method described in
EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-6 with the board horizontal.
°C/W
Junction to ambient (@200 ft/min)
Four layer board
(2s2p)
θ
JMA
341,2
°C/W
Junction to board
—
θ
JB
273
3 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8.
Board temperature is measured on the top surface of the board near the package.
323
°C/W
Junction to case
—
θ
JC
164
4 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
194
°C/W
Junction to top of package
—
Ψ
jt
41,5
5 Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written in conformance with Psi-JT.
°C/W
Maximum operating junction temperature
—
Tj
105
oC
T
J
T
A
P
D
Θ
JMA
×
()
+
=
P
D
K
T
J
273
°C
+
()
---------------------------------
=
KP
D
T
A
273
°C
×
() Q
JMA
P
D
2
×
+
×
=
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MCF5327CVM240,
MCF53281CVM240,
MCF5328CVM240,
MCF5329CVM240
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|---|---|
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| MCF5372CAB180 | 32-BIT, 180 MHz, RISC PROCESSOR, PQFP160 |
| MCF53721CVM240 | 32-BIT, 240 MHz, RISC PROCESSOR, PBGA196 |
| MCF5373CAB180 | 32-BIT, 180 MHz, RISC PROCESSOR, PQFP160 |
| MCF5372LCVM240 | 32-BIT, 240 MHz, RISC PROCESSOR, PBGA196 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF5327CVM240J | 制造商:Freescale Semiconductor 功能描述:MPC5XXX RISC 32-BIT CMOS 240MHZ 196-PIN MA-BGA TRAY - Trays |
| MCF5328 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor |
| MCF53281 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor |
| MCF53281CVM240 | 功能描述:微处理器 - MPU MCF5329 DRAGONFIRE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MCF53281CVM240J | 功能描述:32位微控制器 - MCU DRAGONFIRE RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
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