参数资料
型号: MCF5372LCVM240
厂商: Freescale Semiconductor
文件页数: 7/46页
文件大小: 0K
描述: IC MPU RISC 240MHZ 196-MAPBGA
产品培训模块: ColdFire® Embedded Voice Solution
标准包装: 126
系列: MCF537x
核心处理器: Coldfire V3
芯体尺寸: 32-位
速度: 240MHz
连通性: EBI/EMI,以太网,I²C,SPI,SSI,UART/USART,USB,USB OTG
外围设备: DMA,POR,PWM,WDT
输入/输出数: 62
程序存储器类型: ROMless
RAM 容量: 32K x 8
电压 - 电源 (Vcc/Vdd): 1.4 V ~ 3.6 V
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 196-LBGA
包装: 托盘
Electrical Characteristics
MCF537x ColdFire Microprocessor Data Sheet, Rev. 4
Freescale Semiconductor
15
5.2
Thermal Characteristics
The average chip-junction temperature (TJ) in °C can be obtained from:
Eqn. 1
Where:
TA
= Ambient Temperature,
°C
QJMA
= Package Thermal Resistance, Junction-to-Ambient,
°C/W
PD
=PINT + PI/O
PINT
=IDD × IVDD, Watts - Chip Internal Power
PI/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
Table 5. Thermal Characteristics
Characteristic
Symbol
256MBGA
196MBGA
160QFP
Unit
Junction to ambient, natural convection
Four layer board
(2s2p)
θ
JMA
371,2
1
θ
JMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
Ψ
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-6 with the board horizontal.
421,2
°C/W
Junction to ambient (@200 ft/min)
Four layer board
(2s2p)
θ
JMA
381,2
°C/W
Junction to board
θ
JB
273
3 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
403
°C/W
Junction to case
θ
JC
164
4 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
394
°C/W
Junction to top of package
Ψ
jt
41,5
5 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
°C/W
Maximum operating junction temperature
Tj
105
oC
T
J
T
A
P
D
Θ
JMA
×
()
+
=
P
D
K
T
J
273
°C
+
()
---------------------------------
=
KP
D
T
A
273
°C
×
() Q
JMA
P
D
2
×
+
×
=
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MCF53721CVM240,
MCF5372LCVM240,
MCF5373LCVM240
相关PDF资料
PDF描述
MCF5407CAI220 IC MPU 32B 220MHZ COLDF 208-FQFP
MCF54418CMJ250 IC MCU 32BIT 256MAPBGA
MCF5475ZP266 IC MPU 32BIT COLDF 388-PBGA
MCF5482CZP166 IC MPU 32BIT COLDF 388-PBGA
MCHC11F1CFNE5 MCU 8BIT 1KRAM 512EE 68-PLCC
相关代理商/技术参数
参数描述
MCF5372LCVM240J 功能描述:32位微控制器 - MCU V3CORE RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
MCF5373 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor
MCF5373_08 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor
MCF5373CAB180 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microprocessor Data Sheet
MCF5373L 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor